Clément J. Fortin

Person

Granby, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Lead-free column interconnect
- Patent number 10,950,573
- Issue date Mar 16, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Finned contact
- Patent number 10,756,041
- Issue date Aug 25, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder joining of electronic structures
- Patent number 10,586,782
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow method for lead-free solder
- Patent number 8,673,761
- Issue date Mar 18, 2014
- International Business Machines Corporation
- Pascal Blais
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technique for verifying the microstructure of lead-free interconnec...
- Patent number 8,514,386
- Issue date Aug 20, 2013
- International Business Machines Corporation
- Christian Bergeron
- G01 - MEASURING TESTING
Information Patent Grant
SMT passive device noflow underfill methodology and structure
- Patent number 7,408,264
- Issue date Aug 5, 2008
- International Business Machines Corporation
- Clément J. Fortin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SMT passive device noflow underfill methodology and structure
- Patent number 7,109,592
- Issue date Sep 19, 2006
- International Business Machines Corporation
- Clément J. Fortin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SMT passive device noflow underfill methodology and structure
- Patent number 6,739,497
- Issue date May 25, 2004
- International Busines Machines Corporation
- Clément J. Fortin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LEAD-FREE COLUMN INTERCONNECT
- Publication number 20200303339
- Publication date Sep 24, 2020
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINNED CONTACT
- Publication number 20200294946
- Publication date Sep 17, 2020
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
- Publication number 20200161272
- Publication date May 21, 2020
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
- Publication number 20190006312
- Publication date Jan 3, 2019
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR VERIFYING THE MICROSTRUCTURE OF LEAD-FREE INTERCONNEC...
- Publication number 20120300220
- Publication date Nov 29, 2012
- International Business Machines Corporation
- Christian Bergeron
- G01 - MEASURING TESTING
Information Patent Application
REFLOW METHOD FOR LEAD-FREE SOLDER
- Publication number 20120211276
- Publication date Aug 23, 2012
- International Business Machines Corporation
- Pascal Blais
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMT passive device noflow underfill methodology and structure
- Publication number 20060290008
- Publication date Dec 28, 2006
- International Business Machines Corporation
- Clement J. Fortin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SMT passive device noflow underfill methodology and structure
- Publication number 20040180469
- Publication date Sep 16, 2004
- Clement J. Fortin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SMT passive device noflow underfill methodology and structure
- Publication number 20030209590
- Publication date Nov 13, 2003
- International Business Machines Corporation
- Clement J. Fortin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Clément J. Fortin

Person

Patents Grantslast 30 patents

Lead-free column interconnect

Finned contact

Lead-free solder joining of electronic structures

Reflow method for lead-free solder

Technique for verifying the microstructure of lead-free interconnec...

SMT passive device noflow underfill methodology and structure

SMT passive device noflow underfill methodology and structure

SMT passive device noflow underfill methodology and structure

Patents Applicationslast 30 patents

LEAD-FREE COLUMN INTERCONNECT

FINNED CONTACT

LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES

LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES

TECHNIQUE FOR VERIFYING THE MICROSTRUCTURE OF LEAD-FREE INTERCONNEC...

REFLOW METHOD FOR LEAD-FREE SOLDER

SMT passive device noflow underfill methodology and structure

SMT passive device noflow underfill methodology and structure

SMT passive device noflow underfill methodology and structure