Coenraad Cornelis Tak

Person

Waalre, NL

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for forming a semiconductor device
- Patent number 11,366,031
- Issue date Jun 21, 2022
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor device and method for forming a pressure sensor device
- Patent number 11,313,749
- Issue date Apr 26, 2022
- Sciosense B.V.
- Joerg Siegert
- G01 - MEASURING TESTING
Information Patent Grant
Sensor package and method of producing the sensor package
- Patent number 11,001,495
- Issue date May 11, 2021
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package for environmental parameter sensors and method for manufact...
- Patent number 10,192,842
- Issue date Jan 29, 2019
- AMS International AG
- Hendrik Bouman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated sensor chip package with directional light sensor, appar...
- Patent number 9,666,637
- Issue date May 30, 2017
- NXP B.V.
- Zoran Zivkovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,461,002
- Issue date Oct 4, 2016
- NXP B.V.
- Jeroen Antoon Croon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect
- Patent number 9,385,099
- Issue date Jul 5, 2016
- NXP, B.V.
- Leonardus Antonius Elisabeth van Gemert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuits separated by through-wafer trench isolation
- Patent number 9,177,852
- Issue date Nov 3, 2015
- NXP B.V.
- Peter Gerard Steeneken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with sensor and method of manufacturing such an...
- Patent number 9,070,695
- Issue date Jun 30, 2015
- NXP, B.V.
- Roel Daamen
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuits separated by through-wafer trench isolation
- Patent number 8,853,816
- Issue date Oct 7, 2014
- NXP B.V.
- Peter Gerard Steeneken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
pH sensor and manufacturing method
- Patent number 8,742,470
- Issue date Jun 3, 2014
- NXP, B.V.
- Matthias Merz
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Sensor Arrangement and Method for Fabricating A Sensor Arrangement
- Publication number 20220260446
- Publication date Aug 18, 2022
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Pressure Sensor Device and Method for Forming a Pressure Sensor Device
- Publication number 20220221363
- Publication date Jul 14, 2022
- Sciosense B.V.
- Jörg Siegert
- G01 - MEASURING TESTING
Information Patent Application
Sensor Package and Method of Producing the Sensor Package
- Publication number 20210229981
- Publication date Jul 29, 2021
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE AND METHOD OF PRODUCING THE SENSOR PACKAGE
- Publication number 20190375628
- Publication date Dec 12, 2019
- ams International AG
- Willem Frederik Adrianus BESLING
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR DEVICE AND METHOD FOR FORMING A PRESSURE SENSOR DEVICE
- Publication number 20190265119
- Publication date Aug 29, 2019
- ams International AG
- Joerg Siegert
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING A SEMICONDUCTOR DEVICE
- Publication number 20190234821
- Publication date Aug 1, 2019
- ams International AG
- Willem Frederik Adrianus BESLING
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160163653
- Publication date Jun 9, 2016
- NXP B.V.
- Jeroen Antoon Croon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE INTERCONNECT
- Publication number 20150279803
- Publication date Oct 1, 2015
- NXP B.V.
- Leonardus Antonius Elisabeth van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD
- Publication number 20150171042
- Publication date Jun 18, 2015
- NXP B.V.
- Hendrik Bouman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Sensor Chip Package with Directional Light Sensor, Appar...
- Publication number 20140361394
- Publication date Dec 11, 2014
- NXP B.V.
- Zoran Zivkovic
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUITS SEPARATED BY THROUGH-WAFER TRENCH ISOLATION
- Publication number 20140342527
- Publication date Nov 20, 2014
- Peter Gerard STEENEKEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PH SENSOR AND MANUFACTURING METHOD
- Publication number 20140262781
- Publication date Sep 18, 2014
- NXP B.V.
- Matthias MERZ
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUITS SEPARATED BY THROUGH-WAFER TRENCH ISOLATION
- Publication number 20140151844
- Publication date Jun 5, 2014
- NXP B.V.
- Peter Gerard STEENEKEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH SENSOR AND METHOD OF MANUFACTURING SUCH AN...
- Publication number 20130069176
- Publication date Mar 21, 2013
- NXP B.V.
- Roel DAAMEN
- G01 - MEASURING TESTING
Information Patent Application
PH SENSOR AND MANUFACTURING METHOD
- Publication number 20130069120
- Publication date Mar 21, 2013
- NXP B.V.
- Matthias MERZ
- G01 - MEASURING TESTING

Coenraad Cornelis Tak

Person

Patents Grantslast 30 patents

Semiconductor device and method for forming a semiconductor device

Pressure sensor device and method for forming a pressure sensor device

Sensor package and method of producing the sensor package

Package for environmental parameter sensors and method for manufact...

Integrated sensor chip package with directional light sensor, appar...

Semiconductor device

Die interconnect

Integrated circuits separated by through-wafer trench isolation

Integrated circuit with sensor and method of manufacturing such an...

Integrated circuits separated by through-wafer trench isolation

pH sensor and manufacturing method

Patents Applicationslast 30 patents

Sensor Arrangement and Method for Fabricating A Sensor Arrangement

Pressure Sensor Device and Method for Forming a Pressure Sensor Device

Sensor Package and Method of Producing the Sensor Package

SENSOR PACKAGE AND METHOD OF PRODUCING THE SENSOR PACKAGE

PRESSURE SENSOR DEVICE AND METHOD FOR FORMING A PRESSURE SENSOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

DIE INTERCONNECT

SENSOR PACKAGE AND MANUFACTURING METHOD

Integrated Sensor Chip Package with Directional Light Sensor, Appar...

INTEGRATED CIRCUITS SEPARATED BY THROUGH-WAFER TRENCH ISOLATION

PH SENSOR AND MANUFACTURING METHOD

INTEGRATED CIRCUITS SEPARATED BY THROUGH-WAFER TRENCH ISOLATION

INTEGRATED CIRCUIT WITH SENSOR AND METHOD OF MANUFACTURING SUCH AN...

PH SENSOR AND MANUFACTURING METHOD