Colby Bellew

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of making through-hole vias in a substrate
- Patent number 7,814,652
- Issue date Oct 19, 2010
- BioScale, Inc.
- Colby Bellew
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATES HAVING THROUGH-HOLE VIAS AND METHOD OF MAKING SAME
- Publication number 20090074951
- Publication date Mar 19, 2009
- BioScale, Inc.
- Colby Bellew
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
Substrates having through-hole vias and method of making same
- Publication number 20040043423
- Publication date Mar 4, 2004
- Molecular Reflections
- Colby Bellew
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL