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COLIN B. STEVENS
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AUSTIN, TX, US
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Patents Grants
last 30 patents
Information
Patent Grant
Stress isolated device package and method of manufacture
Patent number
12,012,328
Issue date
Jun 18, 2024
NXP USA, INC.
Chad Dawson
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Forming a eutectic bond between a wafer having an anti-stiction coa...
Patent number
10,427,929
Issue date
Oct 1, 2019
NXP USA, INC.
Ruben B. Montez
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method for selective etching using dry film photoresist
Patent number
9,960,081
Issue date
May 1, 2018
NXP USA, INC.
Colin Bryant Stevens
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Actively preventing charge induced leakage of semiconductor devices
Patent number
9,790,085
Issue date
Oct 17, 2017
NXP USA, INC.
Dubravka Bilic
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method of making a MEMS die having a MEMS device on a suspended str...
Patent number
9,458,008
Issue date
Oct 4, 2016
FREESCALE SEMICONDUCTOR, INC.
Chad S. Dawson
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
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Patent Application
STRESS ISOLATED DEVICE PACKAGE AND METHOD OF MANUFACTURE
Publication number
20220348456
Publication date
Nov 3, 2022
NXP USA, Inc.
Chad Dawson
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
FABRICATION METHOD FOR SUSPENDED MEMS DEVICE
Publication number
20160272482
Publication date
Sep 22, 2016
FREESCALE SEMICONDUCTOR, INC.
CHAD S. DAWSON
B81 - MICRO-STRUCTURAL TECHNOLOGY