COLIN T. CARVER

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect structures and methods of fabrication
- Patent number 11,887,887
- Issue date Jan 30, 2024
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 11,862,563
- Issue date Jan 2, 2024
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for improved electrical contact between bond...
- Patent number 11,784,123
- Issue date Oct 10, 2023
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for revealing a backside of an integrated circuit device...
- Patent number 11,594,452
- Issue date Feb 28, 2023
- Intel Corporation
- Il-Seok Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of fabrication
- Patent number 11,404,307
- Issue date Aug 2, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 11,328,993
- Issue date May 10, 2022
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for improved electrical contact between bond...
- Patent number 11,289,421
- Issue date Mar 29, 2022
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for revealing a backside of an integrated circuit device...
- Patent number 10,896,847
- Issue date Jan 19, 2021
- Intel Corporation
- Il-Seok Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 10,700,007
- Issue date Jun 30, 2020
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned via below subtractively patterned interconnect
- Patent number 10,546,772
- Issue date Jan 28, 2020
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for revealing a backside of an integrated circuit device...
- Patent number 10,490,449
- Issue date Nov 26, 2019
- Intel Corporation
- Il-Seok Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 9,997,457
- Issue date Jun 12, 2018
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects with fully clad lines
- Patent number 9,385,085
- Issue date Jul 5, 2016
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects with fully clad lines
- Patent number 9,165,824
- Issue date Oct 20, 2015
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20240145391
- Publication date May 2, 2024
- Tahoe Research, Ltd.
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT AND HEAT BALANCING CONSTANT VOLTAGE CHARGING
- Publication number 20240088701
- Publication date Mar 14, 2024
- Intel Corporation
- Naoki Matsumura
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF FABRICATION
- Publication number 20220336267
- Publication date Oct 20, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20220238451
- Publication date Jul 28, 2022
- Intel Corporation
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LINES PATTERNED BY BOTTOM-UP FILL METALLIZATION FOR ADVANCED...
- Publication number 20220199516
- Publication date Jun 23, 2022
- Intel Corporation
- Ramanan V. CHEBIAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS & STRUCTURES FOR IMPROVED ELECTRICAL CONTACT BETWEEN BONDED...
- Publication number 20220181251
- Publication date Jun 9, 2022
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR REVEALING A BACKSIDE OF AN INTEGRATED CIRCUIT DEVICE...
- Publication number 20210104435
- Publication date Apr 8, 2021
- Intel Corporation
- Il-Seok SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS & STRUCTURES FOR IMPROVED ELECTRICAL CONTACT BETWEEN BONDED...
- Publication number 20210098359
- Publication date Apr 1, 2021
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NTERCONNECT STRUCTURES AND METHODS OF FABRICATION
- Publication number 20210098360
- Publication date Apr 1, 2021
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20200286836
- Publication date Sep 10, 2020
- Intel Corporation
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR REVEALING A BACKSIDE OF AN INTEGRATED CIRCUIT DEVICE...
- Publication number 20190371666
- Publication date Dec 5, 2019
- Intel Corporation
- Il-Seok SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED VIA BELOW SUBTRACTIVELY PATTERNED INTERCONNECT
- Publication number 20190035677
- Publication date Jan 31, 2019
- Intel Corporation
- Manish CHANDHOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR REVEALING A BACKSIDE OF AN INTEGRATED CIRCUIT DEVICE...
- Publication number 20180233409
- Publication date Aug 16, 2018
- Intel Corporation
- Il-Seok SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20180211918
- Publication date Jul 26, 2018
- Intel Corporation
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS WITH FULLY CLAD LINES
- Publication number 20160005692
- Publication date Jan 7, 2016
- Intel Corporation
- MANISH CHANDHOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20150179579
- Publication date Jun 25, 2015
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS WITH FULLY CLAD LINES
- Publication number 20150091175
- Publication date Apr 2, 2015
- MANISH CHANDHOK
- H01 - BASIC ELECTRIC ELEMENTS

COLIN T. CARVER

Person

Patents Grantslast 30 patents

Interconnect structures and methods of fabrication

Cobalt based interconnects and methods of fabrication thereof

Methods and structures for improved electrical contact between bond...

Techniques for revealing a backside of an integrated circuit device...

Interconnect structures and methods of fabrication

Cobalt based interconnects and methods of fabrication thereof

Methods and structures for improved electrical contact between bond...

Techniques for revealing a backside of an integrated circuit device...

Cobalt based interconnects and methods of fabrication thereof

Self-aligned via below subtractively patterned interconnect

Techniques for revealing a backside of an integrated circuit device...

Cobalt based interconnects and methods of fabrication thereof

Interconnects with fully clad lines

Interconnects with fully clad lines

Patents Applicationslast 30 patents

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

CURRENT AND HEAT BALANCING CONSTANT VOLTAGE CHARGING

INTERCONNECT STRUCTURES AND METHODS OF FABRICATION

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

METAL LINES PATTERNED BY BOTTOM-UP FILL METALLIZATION FOR ADVANCED...

METHODS & STRUCTURES FOR IMPROVED ELECTRICAL CONTACT BETWEEN BONDED...

TECHNIQUES FOR REVEALING A BACKSIDE OF AN INTEGRATED CIRCUIT DEVICE...

METHODS & STRUCTURES FOR IMPROVED ELECTRICAL CONTACT BETWEEN BONDED...

NTERCONNECT STRUCTURES AND METHODS OF FABRICATION

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

TECHNIQUES FOR REVEALING A BACKSIDE OF AN INTEGRATED CIRCUIT DEVICE...

SELF-ALIGNED VIA BELOW SUBTRACTIVELY PATTERNED INTERCONNECT

TECHNIQUES FOR REVEALING A BACKSIDE OF AN INTEGRATED CIRCUIT DEVICE...

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

INTERCONNECTS WITH FULLY CLAD LINES

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

INTERCONNECTS WITH FULLY CLAD LINES