Collin Howder

Person

Meridian, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuitry comprising a memory array comprising strings o...
- Patent number 12,200,929
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Collin Howder
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 12,185,545
- Issue date Dec 31, 2024
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 12,167,600
- Issue date Dec 10, 2024
- Collin Howder
Information Patent Grant
Methods of forming microelectronic devices
- Patent number 12,137,564
- Issue date Nov 5, 2024
- Micron Technology, Inc.
- Collin Howder
Information Patent Grant
Integrated assemblies having metal-containing liners along bottoms...
- Patent number 12,063,782
- Issue date Aug 13, 2024
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays comprising strings of memory cells and methods used i...
- Patent number 12,040,253
- Issue date Jul 16, 2024
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive via of integrated circuitry, memory array comprising str...
- Patent number 11,972,978
- Issue date Apr 30, 2024
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices comprising a dielectric material, and related sy...
- Patent number 11,948,992
- Issue date Apr 2, 2024
- Micron Technology, Inc.
- Michael A. Lindemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including staircase structures, and related...
- Patent number 11,894,305
- Issue date Feb 6, 2024
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays comprising strings of memory cells and methods used i...
- Patent number 11,871,566
- Issue date Jan 9, 2024
- Collin Howder
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,737,278
- Issue date Aug 22, 2023
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including filled slits and memory cell pill...
- Patent number 11,737,275
- Issue date Aug 22, 2023
- Micron Technology, Inc.
- Collin Howder
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,690,226
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Collin Howder
Information Patent Grant
Memory arrays and methods used in forming a memory array
- Patent number 11,678,483
- Issue date Jun 13, 2023
- Micron Technology, Inc.
- Bharat Bhushan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuitry and method used in forming a memory array comp...
- Patent number 11,545,430
- Issue date Jan 3, 2023
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having metal-containing liners along bottoms...
- Patent number 11,538,822
- Issue date Dec 27, 2022
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory array and a method used in forming a memory array
- Patent number 11,527,550
- Issue date Dec 13, 2022
- Micron Technology, Inc.
- Changhan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry, a method used in forming integrated circuitry...
- Patent number 11,495,610
- Issue date Nov 8, 2022
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array
- Patent number 11,411,015
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive via of integrated circuitry, memory array comprising str...
- Patent number 11,355,392
- Issue date Jun 7, 2022
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,348,939
- Issue date May 31, 2022
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,335,694
- Issue date May 17, 2022
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices, and related microelectr...
- Patent number 11,315,877
- Issue date Apr 26, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays, and methods of forming memory arrays
- Patent number 11,302,708
- Issue date Apr 12, 2022
- Micron Technology, Inc.
- Changhan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays comprising strings of memory cells and methods used i...
- Patent number 11,276,701
- Issue date Mar 15, 2022
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array
- Patent number 11,177,269
- Issue date Nov 16, 2021
- Micron Technology, Inc.
- Bharat Bhushan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory arrays and methods used in forming a memory array
- Patent number 11,075,215
- Issue date Jul 27, 2021
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array
- Patent number 11,056,507
- Issue date Jul 6, 2021
- Micron Technology, Inc.
- Collin Howder
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of forming integrated assemblies
- Patent number 10,943,921
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory array and a method used in forming a memory array
- Patent number 10,937,798
- Issue date Mar 2, 2021
- Micron Technology, Inc.
- Changhan Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Memory Circuitry And Methods Used In Forming Memory Circuitry
- Publication number 20240349505
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Yiping Wang
Information Patent Application
Memory Circuitry And Methods Used In Forming Memory Circuitry
- Publication number 20240315027
- Publication date Sep 19, 2024
- Micron Technology, Inc.
- Darwin A. Clampitt
Information Patent Application
ELECTRONIC DEVICES COMPRISING A STACK STRUCTURE, A SOURCE CONTACT,...
- Publication number 20240162325
- Publication date May 16, 2024
- Micron Technology, Inc.
- Michael A. Lindemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20240164092
- Publication date May 16, 2024
- Lodestar Licensing Group, LLC
- Collin Howder
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...
- Publication number 20240153877
- Publication date May 9, 2024
- Lodestar Licensing Group LLC
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20240113012
- Publication date Apr 4, 2024
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCESS CIRCUITRY STRUCTURES FOR THREE-DIMENSIONAL MEMORY ARRAY
- Publication number 20240088044
- Publication date Mar 14, 2024
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH A TIERED STACK OF CONDUCTIVE, INSULATI...
- Publication number 20240074177
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- David H. Wells
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Circuitry And Method Used In Forming Memory Circuitry
- Publication number 20240047362
- Publication date Feb 8, 2024
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING A SOURCE IMPLANT REGION, AND RELATED...
- Publication number 20240030285
- Publication date Jan 25, 2024
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE STRUCTURES FOR ACCESSING THREE-DIMENSIONAL MEMORY ARRAYS
- Publication number 20240021521
- Publication date Jan 18, 2024
- Micron Technology, Inc.
- Collin Howder
- G11 - INFORMATION STORAGE
Information Patent Application
Memory Circuitry And Method Used In Forming Memory Circuitry
- Publication number 20230395513
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Harsh Narendrakumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Circuitry And Method Used In Forming Memory Circuitry
- Publication number 20230389312
- Publication date Nov 30, 2023
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES
- Publication number 20230389318
- Publication date Nov 30, 2023
- Micron Technology, Inc.
- Collin Howder
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230386575
- Publication date Nov 30, 2023
- Micron Technology, Inc.
- Haoyu Li
- G11 - INFORMATION STORAGE
Information Patent Application
Memory Arrays and Methods Used in Forming a Memory Array Comprising...
- Publication number 20230337429
- Publication date Oct 19, 2023
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230320091
- Publication date Oct 5, 2023
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230320092
- Publication date Oct 5, 2023
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20230284451
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Collin Howder
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230062403
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuitry Comprising A Memory Array Comprising Strings O...
- Publication number 20230057852
- Publication date Feb 23, 2023
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230055319
- Publication date Feb 23, 2023
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Assemblies Having Metal-Containing Liners Along Bottoms...
- Publication number 20230005956
- Publication date Jan 5, 2023
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING FILLED SLITS AND MEMORY CELL PILL...
- Publication number 20220336485
- Publication date Oct 20, 2022
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Via Of Integrated Circuitry, Memory Array Comprising Str...
- Publication number 20220262678
- Publication date Aug 18, 2022
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20220254810
- Publication date Aug 11, 2022
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING A DIELECTRIC MATERIAL, AND RELATED SY...
- Publication number 20220238684
- Publication date Jul 28, 2022
- Micron Technology, Inc.
- Michael A. Lindemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH VERTICALLY RECESSED CHANNEL STRUCTURES...
- Publication number 20220238548
- Publication date Jul 28, 2022
- Micron Technology, Inc.
- Haitao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...
- Publication number 20220238444
- Publication date Jul 28, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays and Methods Used in Forming a Memory Array Comprising...
- Publication number 20220231046
- Publication date Jul 21, 2022
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS

Collin Howder

Person

Patents Grantslast 30 patents

Integrated circuitry comprising a memory array comprising strings o...

Memory arrays and methods used in forming a memory array comprising...

Integrated assemblies, and methods of forming integrated assemblies

Methods of forming microelectronic devices

Integrated assemblies having metal-containing liners along bottoms...

Memory arrays comprising strings of memory cells and methods used i...

Conductive via of integrated circuitry, memory array comprising str...

Electronic devices comprising a dielectric material, and related sy...

Microelectronic devices including staircase structures, and related...

Memory arrays comprising strings of memory cells and methods used i...

Memory arrays and methods used in forming a memory array comprising...

Microelectronic devices including filled slits and memory cell pill...

Integrated assemblies, and methods of forming integrated assemblies

Memory arrays and methods used in forming a memory array

Integrated circuitry and method used in forming a memory array comp...

Integrated assemblies having metal-containing liners along bottoms...

Memory array and a method used in forming a memory array

Integrated circuitry, a method used in forming integrated circuitry...

Memory arrays and methods used in forming a memory array

Conductive via of integrated circuitry, memory array comprising str...

Integrated assemblies, and methods of forming integrated assemblies

Memory arrays and methods used in forming a memory array comprising...

Methods of forming microelectronic devices, and related microelectr...

Memory arrays, and methods of forming memory arrays

Memory arrays comprising strings of memory cells and methods used i...

Memory arrays and methods used in forming a memory array

Memory arrays and methods used in forming a memory array

Memory arrays and methods used in forming a memory array

Methods of forming integrated assemblies

Memory array and a method used in forming a memory array

Patents Applicationslast 30 patents

Memory Circuitry And Methods Used In Forming Memory Circuitry

Memory Circuitry And Methods Used In Forming Memory Circuitry

ELECTRONIC DEVICES COMPRISING A STACK STRUCTURE, A SOURCE CONTACT,...

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

ACCESS CIRCUITRY STRUCTURES FOR THREE-DIMENSIONAL MEMORY ARRAY

MICROELECTRONIC DEVICES WITH A TIERED STACK OF CONDUCTIVE, INSULATI...

Memory Circuitry And Method Used In Forming Memory Circuitry

ELECTRONIC DEVICES COMPRISING A SOURCE IMPLANT REGION, AND RELATED...

STAIRCASE STRUCTURES FOR ACCESSING THREE-DIMENSIONAL MEMORY ARRAYS

Memory Circuitry And Method Used In Forming Memory Circuitry

Memory Circuitry And Method Used In Forming Memory Circuitry

METHODS OF FORMING MICROELECTRONIC DEVICES

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

Memory Arrays and Methods Used in Forming a Memory Array Comprising...

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

Integrated Assemblies, and Methods of Forming Integrated Assemblies

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

Integrated Circuitry Comprising A Memory Array Comprising Strings O...

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

Integrated Assemblies Having Metal-Containing Liners Along Bottoms...

MICROELECTRONIC DEVICES INCLUDING FILLED SLITS AND MEMORY CELL PILL...

Conductive Via Of Integrated Circuitry, Memory Array Comprising Str...

Integrated Assemblies, and Methods of Forming Integrated Assemblies

ELECTRONIC DEVICES COMPRISING A DIELECTRIC MATERIAL, AND RELATED SY...

MICROELECTRONIC DEVICES WITH VERTICALLY RECESSED CHANNEL STRUCTURES...

MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...

Memory Arrays and Methods Used in Forming a Memory Array Comprising...