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Gravina Di Catania, IT

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Patents Grantslast 30 patents

Information Patent Grant
Integrated electronic device having a dissipative package, in parti...
- Patent number 10,964,627
- Issue date Mar 30, 2021
- STMicroelectronics S.r.l.
- Concetto Privitera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic device having a dissipative package, in parti...
- Patent number 10,535,587
- Issue date Jan 14, 2020
- STMicroelectronics S.r.l.
- Concetto Privitera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising at least a chip enclosed in a package...
- Patent number 9,159,652
- Issue date Oct 13, 2015
- STMicroelectronics S.r.l.
- Concetto Privitera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package/heatsink system for electronic device
- Patent number 9,105,598
- Issue date Aug 11, 2015
- STMicroelectronics S.R.L.
- Cristiano Gianluca Stella
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
System with stabilized heatsink
- Patent number 8,837,154
- Issue date Sep 16, 2014
- STMicroelectronics S.R.L.
- Cristiano Gianluca Stella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System with shared heatsink
- Patent number 8,817,475
- Issue date Aug 26, 2014
- STMicroelectronics S.R.L.
- Concetto Privitera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wave soldering of surface-mounting electronic devices on printed ci...
- Patent number 8,453,917
- Issue date Jun 4, 2013
- STMicroelectronics S.R.L.
- Concetto Privitera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED ELECTRONIC DEVICE HAVING A DISSIPATIVE PACKAGE, IN PARTI...
- Publication number 20200098670
- Publication date Mar 26, 2020
- STMicroelectronics S.r.l.
- Concetto PRIVITERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC DEVICE HAVING A DISSIPATIVE PACKAGE, IN PARTI...
- Publication number 20160225699
- Publication date Aug 4, 2016
- STMicroelectronics S.r.l.
- Concetto PRIVITERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING AT LEAST A CHIP ENCLOSED IN A PACKAGE...
- Publication number 20140239502
- Publication date Aug 28, 2014
- STMicroelectronics S.r.l.
- Concetto Privitera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVE SOLDERING OF SURFACE-MOUNTING ELECTRONIC DEVICES ON PRINTED CI...
- Publication number 20130126590
- Publication date May 23, 2013
- STMICROELECTRONICS S.R.L.
- Concetto Privitera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM WITH SHARED HEATSINK
- Publication number 20130003311
- Publication date Jan 3, 2013
- STMicroelectronics S.r.l
- Concetto Privitera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM WITH STABILIZED HEATSINK
- Publication number 20130003313
- Publication date Jan 3, 2013
- STMicroelectronics S.r.l
- Cristiano Gianluca Stella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE/HEATSINK SYSTEM FOR ELECTRONIC DEVICE
- Publication number 20130003312
- Publication date Jan 3, 2013
- STMicroelectronics S.r.l
- Cristiano Gianluca Stella
- H01 - BASIC ELECTRIC ELEMENTS

Concetto Privitera

Person

Patents Grantslast 30 patents

Integrated electronic device having a dissipative package, in parti...

Integrated electronic device having a dissipative package, in parti...

Electronic device comprising at least a chip enclosed in a package...

Package/heatsink system for electronic device

System with stabilized heatsink

System with shared heatsink

Wave soldering of surface-mounting electronic devices on printed ci...

Patents Applicationslast 30 patents

INTEGRATED ELECTRONIC DEVICE HAVING A DISSIPATIVE PACKAGE, IN PARTI...

INTEGRATED ELECTRONIC DEVICE HAVING A DISSIPATIVE PACKAGE, IN PARTI...

ELECTRONIC DEVICE COMPRISING AT LEAST A CHIP ENCLOSED IN A PACKAGE...

WAVE SOLDERING OF SURFACE-MOUNTING ELECTRONIC DEVICES ON PRINTED CI...

SYSTEM WITH SHARED HEATSINK

SYSTEM WITH STABILIZED HEATSINK

PACKAGE/HEATSINK SYSTEM FOR ELECTRONIC DEVICE