Connie M. Wong

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Fremont, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer interconnection and method
- Patent number 6,543,674
- Issue date Apr 8, 2003
- Fujitsu Limited
- Michael G. Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive interconnect structures and methods for forming conducti...
- Patent number 6,469,394
- Issue date Oct 22, 2002
- Fujitsu Limited
- Connie M. Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire interconnect structures for connecting an integrated circuit t...
- Patent number 5,773,889
- Issue date Jun 30, 1998
- Fujitsu Limited
- David George Love
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire interconnect structures for connecting an integrated circuit t...
- Patent number 5,536,362
- Issue date Jul 16, 1996
- Fujitsu Limited
- David G. Love
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire interconnect structures for connecting an integrated circuit t...
- Patent number 5,334,804
- Issue date Aug 2, 1994
- Fujitsu Limited
- David G. Love
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multilayer interconnection and method
- Publication number 20020104873
- Publication date Aug 8, 2002
- Michael G. Lee
- H01 - BASIC ELECTRIC ELEMENTS