Connie Tangpuz

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Lapulapu City, PH

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Patents Grantslast 30 patents

Information Patent Grant
Method to manufacture a universal footprint for a package with expo...
- Patent number 7,256,479
- Issue date Aug 14, 2007
- Fairchild Semiconductor Corporation
- Jonathan A. Noquil
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip substrate design
- Patent number 7,101,734
- Issue date Sep 5, 2006
- Fairchild Semiconductor Corporation
- Honorio T. Granada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip substrate design
- Patent number 6,661,082
- Issue date Dec 9, 2003
- Fairchild Semiconductor Corporation
- Honorio T. Granada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING STAND OFF STRUCTURES
- Publication number 20090057855
- Publication date Mar 5, 2009
- Maria Clemens Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to manufacture a universal footprint for a package with expo...
- Publication number 20060151861
- Publication date Jul 13, 2006
- Jonathan A. Noquil
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flip chip substrate design
- Publication number 20050051878
- Publication date Mar 10, 2005
- Fairchild Semiconductor Corporation
- Honorio T. Granada
- H01 - BASIC ELECTRIC ELEMENTS