Conrad A. Barile

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Wappingers Falls, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for prediction of premature dielectric breakdown in a semico...
- Patent number 8,053,257
- Issue date Nov 8, 2011
- International Business Machines Corporation
- Kaushik Chanda
- G01 - MEASURING TESTING
Information Patent Grant
Via barrier layers continuous with metal line barrier layers at not...
- Patent number 7,138,714
- Issue date Nov 21, 2006
- International Business Machines Corporation
- Du B. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via-stud with improved reliability in copper metallurgy
- Patent number 6,972,209
- Issue date Dec 6, 2005
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bipolar transistor fabrication process with an ion implanted emitter
- Patent number 4,243,435
- Issue date Jan 6, 1981
- International Business Machines Corporation
- Conrad A. Barile
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit region through the combinat...
- Patent number 4,060,427
- Issue date Nov 29, 1977
- IBM Corporation
- Conrad A. Barile
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PREDICTION OF PREMATURE DIELECTRIC BREAKDOWN IN A SEMICO...
- Publication number 20080174334
- Publication date Jul 24, 2008
- International Business Machines Corporation
- Kaushik Chanda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR PREDICTION OF PREMATURE DIELECTRIC BREAKDOWN IN A SEMICO...
- Publication number 20060281338
- Publication date Dec 14, 2006
- International Business Machines Corporation
- Kaushik Chanda
- G01 - MEASURING TESTING
Information Patent Application
RELIABILITY AND FUNCTIONALITY IMPROVEMENTS ON COPPER INTERCONNECTS...
- Publication number 20060180930
- Publication date Aug 17, 2006
- International Business Machines Corporation
- Du B. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked via-stud with improved reliability in copper metallurgy
- Publication number 20060014376
- Publication date Jan 19, 2006
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked via-stud with improved reliability in copper metallurgy
- Publication number 20040101663
- Publication date May 27, 2004
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS