Conrad Cachia

Person

Tarxien, MT

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer level package for a mems sensor device and corresponding manu...
- Patent number 10,882,738
- Issue date Jan 5, 2021
- STMicroelectronics (Malta) Ltd.
- Conrad Cachia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package for a MEMS sensor device and corresponding manu...
- Patent number 10,435,290
- Issue date Oct 8, 2019
- STMicroelectronics (Malta) Ltd.
- Conrad Cachia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package for a MEMS sensor device and corresponding manu...
- Patent number 9,802,813
- Issue date Oct 31, 2017
- STMicroelectronics (Malta) Ltd.
- Conrad Cachia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packages for semiconductor devices and methods for assembling same
- Patent number 9,527,727
- Issue date Dec 27, 2016
- STMicroelectronics (Malta) Ltd.
- Conrad Cachia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of stacking a plurality of dies to form a stacked semiconduc...
- Patent number 9,290,377
- Issue date Mar 22, 2016
- STMicroelectronics (Malta) Ltd.
- Conrad Cachia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for strip testing of MEMS devices, testing strip of MEMS dev...
- Patent number 8,748,291
- Issue date Jun 10, 2014
- STMicroelectronics S.r.l.
- Mark Anthony Azzopardi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package substrate and methods for forming same, in pa...
- Patent number 8,633,583
- Issue date Jan 21, 2014
- STMicroelectrics S.r.l.
- Federico Giovanni Ziglioli
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL PACKAGE FOR A MEMS SENSOR DEVICE AND CORRESPONDING MANU...
- Publication number 20190375627
- Publication date Dec 12, 2019
- STMicroelectronics (Malta) Ltd.
- Conrad CACHIA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PACKAGE FOR A MEMS SENSOR DEVICE AND CORRESPONDING MANU...
- Publication number 20180044170
- Publication date Feb 15, 2018
- STMicroelectronics (Malta) Ltd.
- Conrad CACHIA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PACKAGE FOR A MEMS SENSOR DEVICE AND CORRESPONDING MANU...
- Publication number 20160185593
- Publication date Jun 30, 2016
- STMicroelectronics (Malta) Ltd.
- Conrad CACHIA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGES FOR SEMICONDUCTOR DEVICES AND METHODS FOR ASSEMBLING SAME
- Publication number 20160090301
- Publication date Mar 31, 2016
- STMicroelectronics (Malta) Ltd
- Conrad Cachia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF STACKING A PLURALITY OF DIES TO FORM A STACKED SEMICONDUC...
- Publication number 20150145077
- Publication date May 28, 2015
- STMicroelectronics (Malta) Ltd.
- Conrad Cachia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR STRIP TESTING OF MEMS DEVICES, TESTING STRIP OF MEMS DEV...
- Publication number 20130082258
- Publication date Apr 4, 2013
- STMICROELECTRONICS LTD (MALTA)
- Mark Anthony Azzopardi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor package substrate and methods for forming same, In pa...
- Publication number 20080128891
- Publication date Jun 5, 2008
- STMicroelectronics S.r.l. STMicroelectronics (Malta) Ltd.
- Federico Giovanni Ziglioli
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Conrad Cachia

Person

Patents Grantslast 30 patents

Wafer level package for a mems sensor device and corresponding manu...

Wafer level package for a MEMS sensor device and corresponding manu...

Wafer level package for a MEMS sensor device and corresponding manu...

Packages for semiconductor devices and methods for assembling same

Method of stacking a plurality of dies to form a stacked semiconduc...

Method for strip testing of MEMS devices, testing strip of MEMS dev...

Semiconductor package substrate and methods for forming same, in pa...

Patents Applicationslast 30 patents

WAFER LEVEL PACKAGE FOR A MEMS SENSOR DEVICE AND CORRESPONDING MANU...

WAFER LEVEL PACKAGE FOR A MEMS SENSOR DEVICE AND CORRESPONDING MANU...

WAFER LEVEL PACKAGE FOR A MEMS SENSOR DEVICE AND CORRESPONDING MANU...

PACKAGES FOR SEMICONDUCTOR DEVICES AND METHODS FOR ASSEMBLING SAME

METHOD OF STACKING A PLURALITY OF DIES TO FORM A STACKED SEMICONDUC...

METHOD FOR STRIP TESTING OF MEMS DEVICES, TESTING STRIP OF MEMS DEV...

Semiconductor package substrate and methods for forming same, In pa...