Corey Reichman

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Mesa, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,046,798
- Issue date Jul 23, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Corey Reichman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded ball land substrate, semiconductor package, and manufactur...
- Patent number 11,335,643
- Issue date May 17, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Corey Reichman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded ball land substrate, semiconductor package, and manufactur...
- Patent number 10,818,602
- Issue date Oct 27, 2020
- Amkor Technology, Inc.
- Corey Reichman
- G01 - MEASURING TESTING
Information Patent Grant
Embedded die in panel method and structure
- Patent number 9,576,917
- Issue date Feb 21, 2017
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240332781
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Corey REICHMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20230012815
- Publication date Jan 19, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Corey REICHMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BALL LAND SUBSTRATE, SEMICONDUCTOR PACKAGE, AND MANUFACTUR...
- Publication number 20210043578
- Publication date Feb 11, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Corey Reichman
- G01 - MEASURING TESTING
Information Patent Application
EMBEDDED BALL LAND SUBSTRATE, SEMICONDUCTOR PACKAGE, AND MANUFACTUR...
- Publication number 20190304916
- Publication date Oct 3, 2019
- Amkor Technology, Inc.
- Corey Reichman
- G01 - MEASURING TESTING
Information Patent Application
EMBEDDED DIE IN PANEL METHOD AND STRUCTURE
- Publication number 20170278810
- Publication date Sep 28, 2017
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method And System For A Chaser Pellet In A Semiconductor Package Mo...
- Publication number 20140124926
- Publication date May 8, 2014
- Corey Reichman
- H01 - BASIC ELECTRIC ELEMENTS