Corinne Maunand-Tussot

Person

Meylan, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for minimizing defects when transferring a semiconductor us...
- Patent number 7,749,862
- Issue date Jul 6, 2010
- S.O.I. Tec Silicon on Insulator Technologies
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for preparing a bonding surface of a semiconductor wafer
- Patent number 7,645,392
- Issue date Jan 12, 2010
- S.O.I. Tec Silicon on Insulator Technologies
- Corinne Maunand Tussot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding semiconductor structures together
- Patent number 7,235,461
- Issue date Jun 26, 2007
- S.O.I. Tec Silicon on Insulator Technologies
- Christophe Maleville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a bonding surface of a semiconductor layer of...
- Patent number 7,071,077
- Issue date Jul 4, 2006
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Christophe Maleville
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR MINIMIZING DEFECTS WHEN TRANSFERRING A SEMICONDUCTOR US...
- Publication number 20070117229
- Publication date May 24, 2007
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for preparing a bonding surface of a semiconductor wafer
- Publication number 20060273068
- Publication date Dec 7, 2006
- COMMISSARIAT A L'ENERGIE ATOMIQUE (CEA)
- Corinne Maunand Tussot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for minimizing defects when transferring a semiconductor us...
- Publication number 20060040470
- Publication date Feb 23, 2006
- Nadia Ben Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for preparing a bonding surface of a semiconductor wafer
- Publication number 20050218111
- Publication date Oct 6, 2005
- Christophe Maleville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for bonding semiconductor structures together
- Publication number 20040248379
- Publication date Dec 9, 2004
- Christophe Maleville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for preparing a bonding surface of a semiconductor layer of...
- Publication number 20040209441
- Publication date Oct 21, 2004
- Christophe Maleville
- B08 - CLEANING
Information Patent Application
Method and a device for producing an adhesive surface on a substrate
- Publication number 20040069321
- Publication date Apr 15, 2004
- Christophe Maleville
- H01 - BASIC ELECTRIC ELEMENTS

Corinne Maunand-Tussot

Person

Patents Grantslast 30 patents

Methods for minimizing defects when transferring a semiconductor us...

Methods for preparing a bonding surface of a semiconductor wafer

Method for bonding semiconductor structures together

Method for preparing a bonding surface of a semiconductor layer of...

Patents Applicationslast 30 patents

METHODS FOR MINIMIZING DEFECTS WHEN TRANSFERRING A SEMICONDUCTOR US...

Methods for preparing a bonding surface of a semiconductor wafer

Methods for minimizing defects when transferring a semiconductor us...

Methods for preparing a bonding surface of a semiconductor wafer

Method for bonding semiconductor structures together

Method for preparing a bonding surface of a semiconductor layer of...

Method and a device for producing an adhesive surface on a substrate