Cormac MacNamara

Person

Belfast, GB

People

Patents Grantslast 30 patents

Information Patent Grant
Positive-intrinsic-negative (PIN)/negative-intrinsic-positive (NIP)...
- Patent number 8,169,057
- Issue date May 1, 2012
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for stable processing of thin/fragile substrates
- Patent number 8,148,203
- Issue date Apr 3, 2012
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front lit PIN/NIP diode having a continuous anode/cathode
- Patent number 8,058,091
- Issue date Nov 15, 2011
- Icemos Technology Ltd.
- Robin Wilson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Technique for stable processing of thin/fragile substrates
- Patent number 7,999,348
- Issue date Aug 16, 2011
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodetector array using isolation diffusions as crosstalk inhibit...
- Patent number 7,972,934
- Issue date Jul 5, 2011
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a photodiode array with through-wafer vias
- Patent number 7,910,479
- Issue date Mar 22, 2011
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodetector array using isolation diffusions as crosstalk inhibit...
- Patent number 7,821,089
- Issue date Oct 26, 2010
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodetector array using isolation diffusions as crosstalk inhibit...
- Patent number 7,768,085
- Issue date Aug 3, 2010
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodiode having increased proportion of light-sensitive area to l...
- Patent number 7,741,141
- Issue date Jun 22, 2010
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positive-intrinsic-negative (PIN)/negative-intrinsic-positive (NIP)...
- Patent number 7,741,172
- Issue date Jun 22, 2010
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon wafer having through-wafer vias
- Patent number 7,709,950
- Issue date May 4, 2010
- Icemos Technology Ltd.
- Cormac MacNamara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Front side electrical contact for photodetector array and method of...
- Patent number 7,601,556
- Issue date Oct 13, 2009
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded-wafer superjunction semiconductor device
- Patent number 7,579,667
- Issue date Aug 25, 2009
- Icemos Technology Ltd.
- Conor Brogan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a photodiode array with through-wafer vias
- Patent number 7,579,273
- Issue date Aug 25, 2009
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backlit photodiode and method of manufacturing a backlit photodiode
- Patent number 7,576,404
- Issue date Aug 18, 2009
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front lit PIN/NIP diode having a continuous anode/cathode
- Patent number 7,560,791
- Issue date Jul 14, 2009
- Icemos Technology Ltd.
- Robin Wilson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Silicon wafer having through-wafer vias
- Patent number 7,553,764
- Issue date Jun 30, 2009
- Icemos Technology Ltd.
- Cormac MacNamara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Photodiode having increased proportion of light-sensitive area to l...
- Patent number 7,528,458
- Issue date May 5, 2009
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front side electrical contact for photodetector array and method of...
- Patent number 7,489,014
- Issue date Feb 10, 2009
- ICEMOS Technology, Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded-wafer superjunction semiconductor device
- Patent number 7,446,018
- Issue date Nov 4, 2008
- Icemos Technology Corporation
- Conor Brogan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for stable processing of thin/fragile substrates
- Patent number 7,439,178
- Issue date Oct 21, 2008
- Icemos Technology Corporation
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite semiconductor wafer and a method for forming the composit...
- Patent number 6,841,848
- Issue date Jan 11, 2005
- Analog Devices, Inc.
- Cormac John MacNamara
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
TECHNIQUE FOR STABLE PROCESSING OF THIN/FRAGILE SUBSTRATES
- Publication number 20110266659
- Publication date Nov 3, 2011
- Icemos Technology Ltd.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT WAFER-BONDED THROUGH-HOLE PHOTODIODE
- Publication number 20110042576
- Publication date Feb 24, 2011
- ICEMOS TECHNOLOGY LTD.
- Robin WILSON
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Silicon Wafer Having Through-Wafer Vias With A Predetermined Geomet...
- Publication number 20090253261
- Publication date Oct 8, 2009
- ICEMOS TECHNOLOGY LTD.
- Cormac MACNAMARA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Manufacturing a Photodiode Array with Through-Wafer Vias
- Publication number 20090224352
- Publication date Sep 10, 2009
- ICEMOS TECHNOLOGY LTD.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photodiode Having Increased Proportion of Light-Sensitive Area to L...
- Publication number 20090176330
- Publication date Jul 9, 2009
- ICEMOS TECHNOLOGY LTD.
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODETECTOR ARRAY USING ISOLATION DIFFUSIONS AS CROSSTALK INHIBIT...
- Publication number 20080315269
- Publication date Dec 25, 2008
- Icemos Technology Corporation
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED-WAFER SUPERJUNCTION SEMICONDUCTOR DEVICE
- Publication number 20080315247
- Publication date Dec 25, 2008
- Icemos Technology Corporation
- Conor Brogan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique for Stable Processing of Thin/Fragile Substrates
- Publication number 20080315345
- Publication date Dec 25, 2008
- Icemos Technology Corporation
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Wafer Having Through-Wafer Vias
- Publication number 20080315368
- Publication date Dec 25, 2008
- Icemos Technology Corporation
- Cormac MacNamara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Front Lip PIN/NIP Diode Having a Continuous Anode/Cathode
- Publication number 20080299698
- Publication date Dec 4, 2008
- Icemos Technology Corporation
- Robin Wilson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
POSITIVE-INTRINSIC-NEGATIVE (PIN)/NEGATIVE-INTRINSIC-POSITIVE (NIP)...
- Publication number 20080246122
- Publication date Oct 9, 2008
- Icemos Technology Corporation
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODETECTOR ARRAY USING ISOLATION DIFFUSIONS AS CROSSTALK INHIBIT...
- Publication number 20080248606
- Publication date Oct 9, 2008
- Icemos Technology Corporation
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT SIDE ELECTRICAL CONTACT FOR PHOTODETECTOR ARRAY AND METHOD OF...
- Publication number 20080248608
- Publication date Oct 9, 2008
- Icemos Technology Corporation
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Varying Pitch Adapter and a Method of Forming a Varying Pitch Adapter
- Publication number 20080122040
- Publication date May 29, 2008
- Icemos Technology Corporation
- Conor Brogan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A PHOTODIODE ARRAY WITH THROUGH-WAFER VIAS
- Publication number 20080099870
- Publication date May 1, 2008
- Icemos Technology Corporation
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Wafer Having Through-Wafer Vias With A Predetermined Geomet...
- Publication number 20080099924
- Publication date May 1, 2008
- Icemos Technology Corporation
- Cormac MacNamara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Technique for Stable Processing of Thin/Fragile Substrates
- Publication number 20070254457
- Publication date Nov 1, 2007
- Icemos Technology Corporation
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT SIDE ELECTRICAL CONTACT FOR PHOTODETECTOR ARRAY AND METHOD OF...
- Publication number 20070215968
- Publication date Sep 20, 2007
- Icemos Technology Corporation
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODIODE HAVING INCREASED PROPORTION OF LIGHT-SENSITIVE AREA TO L...
- Publication number 20070205478
- Publication date Sep 6, 2007
- Icemos Technology Corporation
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Front Lit PIN/NIP Diode Having a Continuous Anode/Cathode
- Publication number 20070111356
- Publication date May 17, 2007
- Icemos Technology Corporation
- Robin Wilson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Positive-Intrinsic-Negative (PIN) / Negative-Intrinsic-Positive (NI...
- Publication number 20070077725
- Publication date Apr 5, 2007
- Icemos Technology Corporation
- Robin Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Wafer Having Through-Wafer Vias
- Publication number 20060275946
- Publication date Dec 7, 2006
- Icemos Technology Corporation
- Cormac MacNamara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPOSITE SEMICONDUCTOR WAFER AND A METHOD FOR FORMING THE COMPOSIT...
- Publication number 20040245605
- Publication date Dec 9, 2004
- Cormac John MacNamara
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Cormac MacNamara

Person

Patents Grantslast 30 patents

Positive-intrinsic-negative (PIN)/negative-intrinsic-positive (NIP)...

Technique for stable processing of thin/fragile substrates

Front lit PIN/NIP diode having a continuous anode/cathode

Technique for stable processing of thin/fragile substrates

Photodetector array using isolation diffusions as crosstalk inhibit...

Method of manufacturing a photodiode array with through-wafer vias

Photodetector array using isolation diffusions as crosstalk inhibit...

Photodetector array using isolation diffusions as crosstalk inhibit...

Photodiode having increased proportion of light-sensitive area to l...

Positive-intrinsic-negative (PIN)/negative-intrinsic-positive (NIP)...

Silicon wafer having through-wafer vias

Front side electrical contact for photodetector array and method of...

Bonded-wafer superjunction semiconductor device

Method of manufacturing a photodiode array with through-wafer vias

Backlit photodiode and method of manufacturing a backlit photodiode

Front lit PIN/NIP diode having a continuous anode/cathode

Silicon wafer having through-wafer vias

Photodiode having increased proportion of light-sensitive area to l...

Front side electrical contact for photodetector array and method of...

Bonded-wafer superjunction semiconductor device

Technique for stable processing of thin/fragile substrates

Composite semiconductor wafer and a method for forming the composit...

Patents Applicationslast 30 patents

TECHNIQUE FOR STABLE PROCESSING OF THIN/FRAGILE SUBSTRATES

DIRECT WAFER-BONDED THROUGH-HOLE PHOTODIODE

Silicon Wafer Having Through-Wafer Vias With A Predetermined Geomet...

Method of Manufacturing a Photodiode Array with Through-Wafer Vias

Photodiode Having Increased Proportion of Light-Sensitive Area to L...

PHOTODETECTOR ARRAY USING ISOLATION DIFFUSIONS AS CROSSTALK INHIBIT...

BONDED-WAFER SUPERJUNCTION SEMICONDUCTOR DEVICE

Technique for Stable Processing of Thin/Fragile Substrates

Silicon Wafer Having Through-Wafer Vias

Front Lip PIN/NIP Diode Having a Continuous Anode/Cathode

POSITIVE-INTRINSIC-NEGATIVE (PIN)/NEGATIVE-INTRINSIC-POSITIVE (NIP)...

PHOTODETECTOR ARRAY USING ISOLATION DIFFUSIONS AS CROSSTALK INHIBIT...

FRONT SIDE ELECTRICAL CONTACT FOR PHOTODETECTOR ARRAY AND METHOD OF...

Varying Pitch Adapter and a Method of Forming a Varying Pitch Adapter

METHOD OF MANUFACTURING A PHOTODIODE ARRAY WITH THROUGH-WAFER VIAS

Silicon Wafer Having Through-Wafer Vias With A Predetermined Geomet...

Technique for Stable Processing of Thin/Fragile Substrates

FRONT SIDE ELECTRICAL CONTACT FOR PHOTODETECTOR ARRAY AND METHOD OF...

PHOTODIODE HAVING INCREASED PROPORTION OF LIGHT-SENSITIVE AREA TO L...

Front Lit PIN/NIP Diode Having a Continuous Anode/Cathode

Positive-Intrinsic-Negative (PIN) / Negative-Intrinsic-Positive (NI...

Silicon Wafer Having Through-Wafer Vias

COMPOSITE SEMICONDUCTOR WAFER AND A METHOD FOR FORMING THE COMPOSIT...