Cornelia Kang-I Tsang

Person

Mohegan Lake, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 11,424,152
- Issue date Aug 23, 2022
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large channel interconnects with through silicon Vias (TSVs) and me...
- Patent number 11,127,715
- Issue date Sep 21, 2021
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bond transfer layers for manufacturable sealing of microflui...
- Patent number 10,625,257
- Issue date Apr 21, 2020
- International Business Machines Corporation
- Joshua T. Smith
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Double layer release temporary bond and debond processes and systems
- Patent number 10,381,255
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Paul S. Andry
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin 3D die with electromagnetic radiation blocking encapsulation
- Patent number 10,347,588
- Issue date Jul 9, 2019
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer debonding using mid-wavelength infrared radiation ablation
- Patent number 10,297,479
- Issue date May 21, 2019
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double layer release temporary bond and debond processes and systems
- Patent number 10,224,229
- Issue date Mar 5, 2019
- International Business Machines Corporation
- Paul S. Andry
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Large channel interconnects with through silicon vias (TSVs) and me...
- Patent number 10,177,116
- Issue date Jan 8, 2019
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of area efficient antennas for phased array or wafer sc...
- Patent number 10,103,450
- Issue date Oct 16, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin 3D die with electromagnetic radiation blocking encapsulation
- Patent number 10,056,337
- Issue date Aug 21, 2018
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stack structures that implement two-phase cooling with radial...
- Patent number 9,941,250
- Issue date Apr 10, 2018
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test probe substrate
- Patent number 9,897,627
- Issue date Feb 20, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test probe substrate
- Patent number 9,851,379
- Issue date Dec 26, 2017
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bond transfer layers for manufacturable sealing of microflui...
- Patent number 9,795,964
- Issue date Oct 24, 2017
- International Business Machines Corporation
- Joshua T. Smith
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low temperature adhesive resins for wafer bonding
- Patent number 9,748,131
- Issue date Aug 29, 2017
- International Business Machines Corporation
- Robert D. Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stack structures that implement two-phase cooling with radial...
- Patent number 9,648,782
- Issue date May 9, 2017
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer debonding using mid-wavelength infrared radiation ablation
- Patent number 9,636,782
- Issue date May 2, 2017
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test probe substrate
- Patent number 9,606,142
- Issue date Mar 28, 2017
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature adhesive resins for wafer bonding
- Patent number 9,601,364
- Issue date Mar 21, 2017
- International Business Machines Corporation
- Robert D. Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesives for bonding handler wafers to device wafers and enabling...
- Patent number 9,586,291
- Issue date Mar 7, 2017
- GLOBALFOUNDRIES Inc.
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integration of area efficient antennas for phased array or wafer sc...
- Patent number 9,472,859
- Issue date Oct 18, 2016
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin, flexible microsystem with integrated energy source
- Patent number 9,472,789
- Issue date Oct 18, 2016
- International Business Machines Corporation
- Paul S. Andry
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Integrated circuit assembly with cushion polymer layer
- Patent number 9,362,223
- Issue date Jun 7, 2016
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flattened substrate surface for substrate bonding
- Patent number 9,355,936
- Issue date May 31, 2016
- GLOBALFOUNDRIES Inc.
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS structure on replacement substrate
- Patent number 9,331,141
- Issue date May 3, 2016
- GLOBALFOUNDRIES Inc.
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature adhesive resins for wafer bonding
- Patent number 9,324,601
- Issue date Apr 26, 2016
- International Business Machines Corporation
- Robert D. Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stack structures that implement two-phase cooling with radial...
- Patent number 9,313,921
- Issue date Apr 12, 2016
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer debonding using long-wavelength infrared radiation ablation
- Patent number 9,269,561
- Issue date Feb 23, 2016
- GLOBALFOUNDRIES Inc.
- Bing Dang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Integrated circuit assembly with cushion polymer layer
- Patent number 9,209,128
- Issue date Dec 8, 2015
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handler wafer removal facilitated by the addition of an amorphous c...
- Patent number 9,171,749
- Issue date Oct 27, 2015
- GlobalFoundries U.S. 2 LLC
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LARGE CHANNEL INTERCONNECTS WITH THROUGH SILICON VIAS (TSVS) AND ME...
- Publication number 20190139938
- Publication date May 9, 2019
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double Layer Release Temporary Bond And Debond Processes And Systems
- Publication number 20190115243
- Publication date Apr 18, 2019
- International Business Machines Corporation
- Paul S. Andry
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN 3D DIE WITH ELECTROMAGNETIC RADIATION BLOCKING ENCAPSULATION
- Publication number 20180342464
- Publication date Nov 29, 2018
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN 3D DIE WITH ELECTROMAGNETIC RADIATION BLOCKING ENCAPSULATION
- Publication number 20180211924
- Publication date Jul 26, 2018
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Bond Transfer Layers for Manufacturable Sealing of Microflui...
- Publication number 20180021774
- Publication date Jan 25, 2018
- International Business Machines Corporation
- Joshua T. Smith
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TEST PROBE SUBSTRATE
- Publication number 20170199222
- Publication date Jul 13, 2017
- International Business Machines Corporation
- Bing Dang
- G01 - MEASURING TESTING
Information Patent Application
TEST PROBE SUBSTRATE
- Publication number 20170199227
- Publication date Jul 13, 2017
- International Business Machines Corporation
- Bing Dang
- G01 - MEASURING TESTING
Information Patent Application
Direct Bond Transfer Layers for Manufacturable Sealing of Microflui...
- Publication number 20170144149
- Publication date May 25, 2017
- International Business Machines Corporation
- Joshua T. Smith
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP STACK STRUCTURES THAT IMPLEMENT TWO-PHASE COOLING WITH RADIAL...
- Publication number 20170125388
- Publication date May 4, 2017
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DEBONDING USING MID-WAVELENGTH INFRARED RADIATION ABLATION
- Publication number 20170125268
- Publication date May 4, 2017
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATION OF AREA EFFICIENT ANTENNAS FOR PHASED ARRAY OR WAFER SC...
- Publication number 20160352023
- Publication date Dec 1, 2016
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double Layer Release Temporary Bond and Debond Processes and Systems
- Publication number 20160329233
- Publication date Nov 10, 2016
- International Business Machines Corporation
- Paul S. Andry
- B32 - LAYERED PRODUCTS
Information Patent Application
LOW TEMPERATURE ADHESIVE RESINS FOR WAFER BONDING
- Publication number 20160204015
- Publication date Jul 14, 2016
- International Business Machines Corporation
- Robert D. Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK STRUCTURES THAT IMPLEMENT TWO-PHASE COOLING WITH RADIAL...
- Publication number 20160165758
- Publication date Jun 9, 2016
- International Business Machines Corporaion
- Thomas J. Brunschwiler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER LASER DEBONDING STRUCTURE WITH TUNABLE ABSORPTION
- Publication number 20160133495
- Publication date May 12, 2016
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE ADHESIVE RESINS FOR WAFER BONDING
- Publication number 20160133501
- Publication date May 12, 2016
- International Business Machines Corporation
- Robert D. Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double Layer Release Temporary Bond and Debond Processes and Systems
- Publication number 20160133486
- Publication date May 12, 2016
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER LASER DEBONDING STRUCTURE WITH TUNABLE ABSORPTION
- Publication number 20160133497
- Publication date May 12, 2016
- International Business Machines Corporation
- Paul S. Andry
- B32 - LAYERED PRODUCTS
Information Patent Application
LOW TEMPERATURE ADHESIVE RESINS FOR WAFER BONDING
- Publication number 20160133498
- Publication date May 12, 2016
- International Business Machines Corporation
- Robert D. Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PROBE SUBSTRATE
- Publication number 20160084876
- Publication date Mar 24, 2016
- International Business Machines Corporation
- Bing Dang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLY WITH CUSHION POLYMER LAYER
- Publication number 20150357283
- Publication date Dec 10, 2015
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF AREA EFFICIENT ANTENNAS FOR PHASED ARRAY OR WAFER SC...
- Publication number 20150340765
- Publication date Nov 26, 2015
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN, FLEXIBLE MICROSYSTEM WITH INTEGRATED ENERGY SOURCE
- Publication number 20150287960
- Publication date Oct 8, 2015
- International Business Machines Corporation
- Paul S. Andry
- G02 - OPTICS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLY WITH CUSHION POLYMER LAYER
- Publication number 20150279779
- Publication date Oct 1, 2015
- Hitachi Chemical DuPont Microsystems, L.L.C.
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE CHANNEL INTERCONNECTS WITH THROUGH SILICON VIAS (TSVS) AND ME...
- Publication number 20150221613
- Publication date Aug 6, 2015
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER WAFER REMOVAL
- Publication number 20150132924
- Publication date May 14, 2015
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DEBONDING USING MID-WAVELENGTH INFRARED RADIATION ABLATION
- Publication number 20150035554
- Publication date Feb 5, 2015
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVES FOR BONDING HANDLER WAFERS TO DEVICE WAFERS AND ENABLING...
- Publication number 20150035173
- Publication date Feb 5, 2015
- International Business Machines Corporation
- Bing Dang
- B32 - LAYERED PRODUCTS
Information Patent Application
FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING
- Publication number 20140209908
- Publication date Jul 31, 2014
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DEBONDING USING LONG-WAVELENGTH INFRARED RADIATION ABLATION
- Publication number 20140144593
- Publication date May 29, 2014
- International Business Machiness Corporation
- Bing Dang
- B82 - NANO-TECHNOLOGY

Cornelia Kang-I Tsang

Person

Patents Grantslast 30 patents

Handler bonding and debonding for semiconductor dies

Large channel interconnects with through silicon Vias (TSVs) and me...

Direct bond transfer layers for manufacturable sealing of microflui...

Double layer release temporary bond and debond processes and systems

Thin 3D die with electromagnetic radiation blocking encapsulation

Wafer debonding using mid-wavelength infrared radiation ablation

Double layer release temporary bond and debond processes and systems

Large channel interconnects with through silicon vias (TSVs) and me...

Integration of area efficient antennas for phased array or wafer sc...

Thin 3D die with electromagnetic radiation blocking encapsulation

Chip stack structures that implement two-phase cooling with radial...

Test probe substrate

Test probe substrate

Direct bond transfer layers for manufacturable sealing of microflui...

Low temperature adhesive resins for wafer bonding

Chip stack structures that implement two-phase cooling with radial...

Wafer debonding using mid-wavelength infrared radiation ablation

Test probe substrate

Low temperature adhesive resins for wafer bonding

Adhesives for bonding handler wafers to device wafers and enabling...

Integration of area efficient antennas for phased array or wafer sc...

Thin, flexible microsystem with integrated energy source

Integrated circuit assembly with cushion polymer layer

Flattened substrate surface for substrate bonding

CMOS structure on replacement substrate

Low temperature adhesive resins for wafer bonding

Chip stack structures that implement two-phase cooling with radial...

Wafer debonding using long-wavelength infrared radiation ablation

Integrated circuit assembly with cushion polymer layer

Handler wafer removal facilitated by the addition of an amorphous c...

Patents Applicationslast 30 patents

LARGE CHANNEL INTERCONNECTS WITH THROUGH SILICON VIAS (TSVS) AND ME...

Double Layer Release Temporary Bond And Debond Processes And Systems

THIN 3D DIE WITH ELECTROMAGNETIC RADIATION BLOCKING ENCAPSULATION

THIN 3D DIE WITH ELECTROMAGNETIC RADIATION BLOCKING ENCAPSULATION

Direct Bond Transfer Layers for Manufacturable Sealing of Microflui...

TEST PROBE SUBSTRATE

TEST PROBE SUBSTRATE

Direct Bond Transfer Layers for Manufacturable Sealing of Microflui...

CHIP STACK STRUCTURES THAT IMPLEMENT TWO-PHASE COOLING WITH RADIAL...

WAFER DEBONDING USING MID-WAVELENGTH INFRARED RADIATION ABLATION

INTEGRATION OF AREA EFFICIENT ANTENNAS FOR PHASED ARRAY OR WAFER SC...

Double Layer Release Temporary Bond and Debond Processes and Systems

LOW TEMPERATURE ADHESIVE RESINS FOR WAFER BONDING

CHIP STACK STRUCTURES THAT IMPLEMENT TWO-PHASE COOLING WITH RADIAL...

MULTI-LAYER LASER DEBONDING STRUCTURE WITH TUNABLE ABSORPTION

LOW TEMPERATURE ADHESIVE RESINS FOR WAFER BONDING

Double Layer Release Temporary Bond and Debond Processes and Systems

MULTI-LAYER LASER DEBONDING STRUCTURE WITH TUNABLE ABSORPTION

LOW TEMPERATURE ADHESIVE RESINS FOR WAFER BONDING

TEST PROBE SUBSTRATE

INTEGRATED CIRCUIT ASSEMBLY WITH CUSHION POLYMER LAYER

INTEGRATION OF AREA EFFICIENT ANTENNAS FOR PHASED ARRAY OR WAFER SC...

THIN, FLEXIBLE MICROSYSTEM WITH INTEGRATED ENERGY SOURCE

INTEGRATED CIRCUIT ASSEMBLY WITH CUSHION POLYMER LAYER

LARGE CHANNEL INTERCONNECTS WITH THROUGH SILICON VIAS (TSVS) AND ME...

HANDLER WAFER REMOVAL

WAFER DEBONDING USING MID-WAVELENGTH INFRARED RADIATION ABLATION

ADHESIVES FOR BONDING HANDLER WAFERS TO DEVICE WAFERS AND ENABLING...

FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING

WAFER DEBONDING USING LONG-WAVELENGTH INFRARED RADIATION ABLATION