Cornelia Tsang YANG

Person

Medford, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microbattery separator
- Patent number 11,258,132
- Issue date Feb 22, 2022
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 11,121,005
- Issue date Sep 14, 2021
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 10,679,887
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 10,586,726
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 10,573,538
- Issue date Feb 25, 2020
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microbattery separator
- Patent number 10,388,929
- Issue date Aug 20, 2019
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 10,325,785
- Issue date Jun 18, 2019
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rapid oxide etch for manufacturing through dielectric via structures
- Patent number 10,276,439
- Issue date Apr 30, 2019
- International Business Machines Corporation
- Sebastian U. Engelmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 10,224,219
- Issue date Mar 5, 2019
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device layer thin-film transfer to thermally conductive substrate
- Patent number 10,032,943
- Issue date Jul 24, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 9,947,570
- Issue date Apr 17, 2018
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
All-silicon hermetic package and processing for narrow, low-profile...
- Patent number 9,876,200
- Issue date Jan 23, 2018
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20200176297
- Publication date Jun 4, 2020
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20200168475
- Publication date May 28, 2020
- INTERNATIONAL BUSINESS MACHINES CORPORATION
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROBATTERY SEPARATOR
- Publication number 20190372075
- Publication date Dec 5, 2019
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20190189469
- Publication date Jun 20, 2019
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RAPID OXIDE ETCH FOR MANUFACTURING THROUGH DIELECTRIC VIA STRUCTURES
- Publication number 20180350677
- Publication date Dec 6, 2018
- International Business Machines Corporation
- Sebastian U. Engelmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20180218934
- Publication date Aug 2, 2018
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20180138072
- Publication date May 17, 2018
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20180138073
- Publication date May 17, 2018
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20170194185
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20170194186
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROBATTERY SEPARATOR
- Publication number 20170179455
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE LAYER THIN-FILM TRANSFER TO THERMALLY CONDUCTIVE SUBSTRATE
- Publication number 20170179307
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALL-SILICON HERMETIC PACKAGE AND PROCESSING FOR NARROW, LOW-PROFILE...
- Publication number 20170040580
- Publication date Feb 9, 2017
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS

Cornelia Tsang YANG

Person

Patents Grantslast 30 patents

Microbattery separator

Handler bonding and debonding for semiconductor dies

Handler bonding and debonding for semiconductor dies

Handler bonding and debonding for semiconductor dies

Handler bonding and debonding for semiconductor dies

Microbattery separator

Handler bonding and debonding for semiconductor dies

Rapid oxide etch for manufacturing through dielectric via structures

Handler bonding and debonding for semiconductor dies

Device layer thin-film transfer to thermally conductive substrate

Handler bonding and debonding for semiconductor dies

All-silicon hermetic package and processing for narrow, low-profile...

Patents Applicationslast 30 patents

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES

MICROBATTERY SEPARATOR

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES

RAPID OXIDE ETCH FOR MANUFACTURING THROUGH DIELECTRIC VIA STRUCTURES

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES

MICROBATTERY SEPARATOR

DEVICE LAYER THIN-FILM TRANSFER TO THERMALLY CONDUCTIVE SUBSTRATE

ALL-SILICON HERMETIC PACKAGE AND PROCESSING FOR NARROW, LOW-PROFILE...