Cornelius B. Peethala

Person

Albany, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Surface conversion in chemical mechanical polishing
- Patent number 11,804,378
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Raghuveer R Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization stop region for use with low pattern density intercon...
- Patent number 11,637,036
- Issue date Apr 25, 2023
- International Business Machines Corporation
- Cornelius Brown Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interconnect structures with wrap around capping layers
- Patent number 11,404,311
- Issue date Aug 2, 2022
- International Business Machines Corporation
- Cornelius Brown Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etching of silicon wafer
- Patent number 11,322,361
- Issue date May 3, 2022
- International Business Machines Corporation
- Da Song
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Metallic interconnect structures with wrap around capping layers
- Patent number 11,315,830
- Issue date Apr 26, 2022
- International Business Machines Corporation
- Cornelius Brown Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable via dimension and chamfer angle
- Patent number 11,276,636
- Issue date Mar 15, 2022
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement metal cap by an exchange reaction
- Patent number 11,251,126
- Issue date Feb 15, 2022
- International Business Machines Corporation
- James J. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having a via-to-line spacer for preventing short circ...
- Patent number 11,244,859
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner and cap structures for reducing local interconnect vertical r...
- Patent number 11,205,587
- Issue date Dec 21, 2021
- International Business Machines Corporation
- Su Chen Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition with SAM for fully aligned via
- Patent number 11,171,054
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Son Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple patterning scheme integration with planarized cut patterning
- Patent number 11,171,001
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom barrier free interconnects without voids
- Patent number 11,164,815
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect and memory structures having reduced topography variat...
- Patent number 11,164,878
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interconnect structure
- Patent number 11,164,776
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Son Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric damage-free dual damascene Cu interconnects without barr...
- Patent number 11,101,172
- Issue date Aug 24, 2021
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet clean solutions to prevent pattern collapse
- Patent number 11,094,527
- Issue date Aug 17, 2021
- International Business Machines Corporation
- Cornelius B. Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization of dielectric topography and stopping in dielectric
- Patent number 11,037,795
- Issue date Jun 15, 2021
- International Business Machines Corporation
- Hari Prasad Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnects
- Patent number 11,031,339
- Issue date Jun 8, 2021
- International Business Machines Corporation
- Raghuveer R. Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnects
- Patent number 11,018,087
- Issue date May 25, 2021
- International Business Machines Corporation
- Raghuveer R. Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive interconnect having a semi-liner and no top surface recess
- Patent number 11,004,735
- Issue date May 11, 2021
- International Business Machines Corporation
- Cornelius B. Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Skip via for metal interconnects
- Patent number 10,978,388
- Issue date Apr 13, 2021
- International Business Machines Corporation
- Hari Prasad Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid BEOL metallization utilizing selective reflection mask
- Patent number 10,957,646
- Issue date Mar 23, 2021
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple patterning scheme integration with planarized cut patterning
- Patent number 10,937,653
- Issue date Mar 2, 2021
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust gate cap for protecting a gate from downstream metallization...
- Patent number 10,916,431
- Issue date Feb 9, 2021
- International Business Machines Corporation
- Raghuveer Reddy Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back end of line metallization structure
- Patent number 10,910,307
- Issue date Feb 2, 2021
- International Business Machines Corporation
- Raghuveer R. Patlolla
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Back end of line metallization structure
- Patent number 10,903,161
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Raghuveer R. Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling performance and reliability of conductive regions in a...
- Patent number 10,896,846
- Issue date Jan 19, 2021
- International Business Machines Corporation
- Raghuveer Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning integration scheme with trench alignment marks
- Patent number 10,879,190
- Issue date Dec 29, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low oxygen cleaning for CMP equipment
- Patent number 10,832,917
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Donald F. Canaperi
- B08 - CLEANING
Information Patent Grant
Bottom electrode and dielectric structure for MRAM applications
- Patent number 10,833,122
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Hari Prasad Amanapu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NON-SHARED METAL GATE INTEGRATION FOR SCALED GATE ALL AROUND (GAA)...
- Publication number 20240079276
- Publication date Mar 7, 2024
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT THAT REDUCES RISK OF CONTACT TO GATE SHORT
- Publication number 20240079446
- Publication date Mar 7, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION AND CROSS-LINKING OF POLYMERIC DIELECTRIC MATE...
- Publication number 20230238236
- Publication date Jul 27, 2023
- International Business Machines Corporation
- Cornelius Brown Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE CONVERSION IN CHEMICAL MECHANICAL POLISHING
- Publication number 20230215734
- Publication date Jul 6, 2023
- International Business Machines Corporation
- Raghuveer R. Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC PLANARIZATION USING A METAL OVERBURDEN WITH ETCH-STOP LA...
- Publication number 20230187274
- Publication date Jun 15, 2023
- International Business Machines Corporation
- Raghuveer Reddy Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etch Back and Film Profile Shaping of Selective Dielectric Deposition
- Publication number 20230178432
- Publication date Jun 8, 2023
- International Business Machines Corporation
- Rudy J. Wojtecki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-DAMASCENE INTERCONNECT HAVING CONTROL OVER CORROSION, DIELEC...
- Publication number 20230170294
- Publication date Jun 1, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bottom Barrier Free Interconnects Without Voids
- Publication number 20220028797
- Publication date Jan 27, 2022
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION WITH SAM FOR FULLY ALIGNED VIA
- Publication number 20210313228
- Publication date Oct 7, 2021
- International Business Machines Corporation
- Son Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Metal Contamination Removal from BEOL Wafers
- Publication number 20210296118
- Publication date Sep 23, 2021
- International Business Machines Corporation
- Devika Sil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT AND MEMORY STRUCTURES HAVING REDUCED TOPOGRAPHY VARIAT...
- Publication number 20210242216
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION STOP REGION FOR USE WITH LOW PATTERN DENSITY INTERCON...
- Publication number 20210242077
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Cornelius Brown Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus For Reducing Wafer Contamination During ION-Beam Etching...
- Publication number 20210183627
- Publication date Jun 17, 2021
- International Business Machines Corporation
- John Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID METALLIZATION AND DIELECTRIC INTERCONNECTS IN TOP VIA CONFIG...
- Publication number 20210143061
- Publication date May 13, 2021
- International Business Machines Corporation
- Hari Prasad Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS HAVING A VIA-TO-LINE SPACER FOR PREVENTING SHORT CIRC...
- Publication number 20210111069
- Publication date Apr 15, 2021
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bottom Barrier Free Interconnects Without Voids
- Publication number 20210098388
- Publication date Apr 1, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC INTERCONNECT STRUCTURE
- Publication number 20210098292
- Publication date Apr 1, 2021
- International Business Machines Corporation
- Son Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adjustable Via Dimension and Chamfer Angle
- Publication number 20210035904
- Publication date Feb 4, 2021
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING INTEGRATION SCHEME WITH TRENCH ALIGNMENT MARKS
- Publication number 20200350257
- Publication date Nov 5, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROBUST GATE CAP FOR PROTECTING A GATE FROM DOWNSTREAM METALLIZATION...
- Publication number 20200335345
- Publication date Oct 22, 2020
- International Business Machines Corporation
- Raghuveer Reddy Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW ASPECT RATIO INTERCONNECT
- Publication number 20200328156
- Publication date Oct 15, 2020
- Tessera, Inc.
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Interconnect Structures with Self-Forming Sidewall Barrier Layer
- Publication number 20200294911
- Publication date Sep 17, 2020
- International Business Machines Corporation
- Hari Prasad Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Damage-Free Dual Damascene Cu Interconnects Without Barr...
- Publication number 20200243379
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM ELECTRODE AND DIELECTRIC STRUCTURE FOR MRAM APPLICATIONS
- Publication number 20200219931
- Publication date Jul 9, 2020
- International Business Machines Corporation
- Hari Prasad Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT METAL CAP BY AN EXCHANGE REACTION
- Publication number 20200219817
- Publication date Jul 9, 2020
- International Business Machines Corporation
- James J. KELLY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE INTEGRATION FOR INTERCONNECTS
- Publication number 20200219759
- Publication date Jul 9, 2020
- International Business Machines Corporation
- Cornelius B. Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BEOL METALLIZATION UTILIZING SELECTIVE REFLECTION MASK
- Publication number 20200176388
- Publication date Jun 4, 2020
- International Business Machines Corporation
- Benjamin D. BRIGGS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC INTERCONNECT STRUCTURES WITH WRAP AROUND CAPPING LAYERS
- Publication number 20200152510
- Publication date May 14, 2020
- International Business Machines Corporation
- Cornelius Brown Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC INTERCONNECT STRUCTURES WITH WRAP AROUND CAPPING LAYERS
- Publication number 20200152511
- Publication date May 14, 2020
- International Business Machines Corporation
- Cornelius Brown Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE METALLIZATION STRUCTURE
- Publication number 20200144178
- Publication date May 7, 2020
- International Business Machines Corporation
- Raghuveer R. Patlolla
- H01 - BASIC ELECTRIC ELEMENTS

Cornelius B. Peethala

Person

Patents Grantslast 30 patents

Surface conversion in chemical mechanical polishing

Planarization stop region for use with low pattern density intercon...

Metallic interconnect structures with wrap around capping layers

Selective etching of silicon wafer

Metallic interconnect structures with wrap around capping layers

Adjustable via dimension and chamfer angle

Replacement metal cap by an exchange reaction

Interconnects having a via-to-line spacer for preventing short circ...

Liner and cap structures for reducing local interconnect vertical r...

Selective deposition with SAM for fully aligned via

Multiple patterning scheme integration with planarized cut patterning

Bottom barrier free interconnects without voids

Interconnect and memory structures having reduced topography variat...

Metallic interconnect structure

Dielectric damage-free dual damascene Cu interconnects without barr...

Wet clean solutions to prevent pattern collapse

Planarization of dielectric topography and stopping in dielectric

Metal interconnects

Metal interconnects

Conductive interconnect having a semi-liner and no top surface recess

Skip via for metal interconnects

Hybrid BEOL metallization utilizing selective reflection mask

Multiple patterning scheme integration with planarized cut patterning

Robust gate cap for protecting a gate from downstream metallization...

Back end of line metallization structure

Back end of line metallization structure

Controlling performance and reliability of conductive regions in a...

Patterning integration scheme with trench alignment marks

Low oxygen cleaning for CMP equipment

Bottom electrode and dielectric structure for MRAM applications

Patents Applicationslast 30 patents

NON-SHARED METAL GATE INTEGRATION FOR SCALED GATE ALL AROUND (GAA)...

BACKSIDE CONTACT THAT REDUCES RISK OF CONTACT TO GATE SHORT

SELECTIVE DEPOSITION AND CROSS-LINKING OF POLYMERIC DIELECTRIC MATE...

SURFACE CONVERSION IN CHEMICAL MECHANICAL POLISHING

DIELECTRIC PLANARIZATION USING A METAL OVERBURDEN WITH ETCH-STOP LA...

Etch Back and Film Profile Shaping of Selective Dielectric Deposition

SINGLE-DAMASCENE INTERCONNECT HAVING CONTROL OVER CORROSION, DIELEC...

Bottom Barrier Free Interconnects Without Voids

SELECTIVE DEPOSITION WITH SAM FOR FULLY ALIGNED VIA

Embedded Metal Contamination Removal from BEOL Wafers

INTERCONNECT AND MEMORY STRUCTURES HAVING REDUCED TOPOGRAPHY VARIAT...

PLANARIZATION STOP REGION FOR USE WITH LOW PATTERN DENSITY INTERCON...

Apparatus For Reducing Wafer Contamination During ION-Beam Etching...

HYBRID METALLIZATION AND DIELECTRIC INTERCONNECTS IN TOP VIA CONFIG...

INTERCONNECTS HAVING A VIA-TO-LINE SPACER FOR PREVENTING SHORT CIRC...

Bottom Barrier Free Interconnects Without Voids

METALLIC INTERCONNECT STRUCTURE

Adjustable Via Dimension and Chamfer Angle

PATTERNING INTEGRATION SCHEME WITH TRENCH ALIGNMENT MARKS

ROBUST GATE CAP FOR PROTECTING A GATE FROM DOWNSTREAM METALLIZATION...

LOW ASPECT RATIO INTERCONNECT

Metal Interconnect Structures with Self-Forming Sidewall Barrier Layer

Dielectric Damage-Free Dual Damascene Cu Interconnects Without Barr...

BOTTOM ELECTRODE AND DIELECTRIC STRUCTURE FOR MRAM APPLICATIONS

REPLACEMENT METAL CAP BY AN EXCHANGE REACTION

BACK END OF LINE INTEGRATION FOR INTERCONNECTS

HYBRID BEOL METALLIZATION UTILIZING SELECTIVE REFLECTION MASK

METALLIC INTERCONNECT STRUCTURES WITH WRAP AROUND CAPPING LAYERS

METALLIC INTERCONNECT STRUCTURES WITH WRAP AROUND CAPPING LAYERS

BACK END OF LINE METALLIZATION STRUCTURE