Cornella K. Tsang

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Mohegan Lake, NY, US

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Patents Applicationslast 30 patents

Information Patent Application
HERMETIC SEAL AND RELIABLE BONDING STRUCTURES FOR 3D APPLICATIONS
- Publication number 20080142958
- Publication date Jun 19, 2008
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS