Craig Bishop

Person

Tucson, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Molded direct contact interconnect structure without capture pads a...
- Patent number 12,170,261
- Issue date Dec 17, 2024
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable fully molded semiconductor structure with through silicon...
- Patent number 12,057,373
- Issue date Aug 6, 2024
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct contact interconnect structure without capture pads a...
- Patent number 11,973,051
- Issue date Apr 30, 2024
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for redistribution layer (RDL) repair by mitigating at least...
- Patent number 11,887,862
- Issue date Jan 30, 2024
- Deca Technologies USA, Inc.
- Craig Bishop
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unit specific variable or adaptive metal fill and system and method...
- Patent number 11,791,207
- Issue date Oct 17, 2023
- Deca Technologies USA, Inc.
- David Ryan Bartling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded semiconductor structure with through silicon via (TSV)...
- Patent number 11,728,248
- Issue date Aug 15, 2023
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step high aspect ratio vertical interconnect and method of ma...
- Patent number 11,664,321
- Issue date May 30, 2023
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable fully molded semiconductor structure with through silicon...
- Patent number 11,616,003
- Issue date Mar 28, 2023
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded bridge interposer and method of making the same
- Patent number 11,538,759
- Issue date Dec 27, 2022
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded semiconductor structure with face mounted passives and...
- Patent number 11,444,051
- Issue date Sep 13, 2022
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable fully molded semiconductor structure with vertical interc...
- Patent number 11,056,453
- Issue date Jul 6, 2021
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making fully molded peripheral package on package device
- Patent number 10,672,624
- Issue date Jun 2, 2020
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of unit specific progressive alignment
- Patent number 10,573,601
- Issue date Feb 25, 2020
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of unit specific progressive alignment
- Patent number 10,157,803
- Issue date Dec 18, 2018
- Deca Technologies Inc.
- Craig Bishop
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated optical inspection of unit specific patterning
- Patent number 10,056,304
- Issue date Aug 21, 2018
- Deca Technologies Inc.
- Craig Bishop
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fully molded peripheral package on package device
- Patent number 10,050,004
- Issue date Aug 14, 2018
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of adaptive patterning for panelize...
- Patent number 9,978,655
- Issue date May 22, 2018
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package comprising unit specific alignment and unit speci...
- Patent number 9,818,659
- Issue date Nov 14, 2017
- Deca Technologies Inc.
- Craig Bishop
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method comprising redistribution layers
- Patent number 9,754,835
- Issue date Sep 5, 2017
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded peripheral package on package device
- Patent number 9,613,830
- Issue date Apr 4, 2017
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method comprising redistribution layers
- Patent number 9,576,919
- Issue date Feb 21, 2017
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front side package-level serialization for packages comprising uniq...
- Patent number 9,520,364
- Issue date Dec 13, 2016
- Deca Technologies Inc.
- Craig Bishop
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated optical inspection of unit specific patterning
- Patent number 9,401,313
- Issue date Jul 26, 2016
- Deca Technologies, Inc.
- Craig Bishop
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of adaptive patterning for panelize...
- Patent number 9,397,069
- Issue date Jul 19, 2016
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method comprising thickened redistribution...
- Patent number 9,177,926
- Issue date Nov 3, 2015
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of adaptive patterning for panelize...
- Patent number 9,040,316
- Issue date May 26, 2015
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package auto-routing
- Patent number 8,656,333
- Issue date Feb 18, 2014
- Deca Technologies, Inc.
- Craig Bishop
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
MOLDED DIRECT CONTACT INTERCONNECT SUBSTRATE AND METHODS OF MAKING...
- Publication number 20240404840
- Publication date Dec 5, 2024
- Deca Technologies USA, Inc.
- Craig Bishop
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH VERTICA...
- Publication number 20240395673
- Publication date Nov 28, 2024
- Deca Technologies USA, Inc.
- Paul R. Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED MOLDED DIRECT CONTACT AND DIELECTRIC STRUCTURE AND METHOD F...
- Publication number 20240243089
- Publication date Jul 18, 2024
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIT SPECIFIC VARIABLE OR ADAPTIVE METAL FILL AND SYSTEM AND METHOD...
- Publication number 20240222193
- Publication date Jul 4, 2024
- David Ryan BARTLING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING A 3D BLOCK AND METHOD OF MAKING T...
- Publication number 20240213135
- Publication date Jun 27, 2024
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT-DEFINED LAND GRID ARRAY (LGA) PACKAGE AND METHOD FOR MA...
- Publication number 20240213202
- Publication date Jun 27, 2024
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDISTRIBUTION LAYER (RDL) REPAIR BY MITIGATING AT LEAST...
- Publication number 20240170300
- Publication date May 23, 2024
- Deca Technologies USA, Inc.
- Craig Bishop
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED DIRECT CONTACT INTERCONNECT STRUCTURE WITHOUT CAPTURE PADS A...
- Publication number 20230411333
- Publication date Dec 21, 2023
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED DIRECT CONTACT INTERCONNECT STRUCTURE WITHOUT CAPTURE PADS A...
- Publication number 20230387060
- Publication date Nov 30, 2023
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON VIA (TSV)...
- Publication number 20230378029
- Publication date Nov 23, 2023
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON...
- Publication number 20230238304
- Publication date Jul 27, 2023
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED BRIDGE INTERPOSER AND METHOD OF MAKING THE SAME
- Publication number 20230142384
- Publication date May 11, 2023
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR REDISTRIBUTION LAYER (RDL) REPAIR
- Publication number 20230085067
- Publication date Mar 16, 2023
- Deca Technologies USA, Inc.
- Craig Bishop
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIT SPECIFIC VARIABLE OR ADAPTIVE METAL FILL AND SYSTEM AND METHOD...
- Publication number 20230047504
- Publication date Feb 16, 2023
- Deca Technologies USA, Inc.
- David Ryan Bartling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON...
- Publication number 20230005819
- Publication date Jan 5, 2023
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON VIA (TSV)...
- Publication number 20230005820
- Publication date Jan 5, 2023
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH FACE MOUNTED PASSIVES AND...
- Publication number 20220352106
- Publication date Nov 3, 2022
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STEP HIGH ASPECT RATIO VERTICAL INTERCONNECT AND METHOD OF MA...
- Publication number 20220246532
- Publication date Aug 4, 2022
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED BRIDGE INTERPOSER AND METHOD OF MAKING THE SAME
- Publication number 20220238445
- Publication date Jul 28, 2022
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH FACE MOUNTED PASSIVES AND...
- Publication number 20220173067
- Publication date Jun 2, 2022
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH VERTICAL INTERC...
- Publication number 20210335744
- Publication date Oct 28, 2021
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH VERTICAL INTERC...
- Publication number 20200402941
- Publication date Dec 24, 2020
- DECA TECHNOLOGIES INC
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF UNIT SPECIFIC PROGRESSIVE ALIGNMENT
- Publication number 20190139901
- Publication date May 9, 2019
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
- Publication number 20180330966
- Publication date Nov 15, 2018
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF UNIT SPECIFIC PROGRESSIVE ALIGNMENT
- Publication number 20180082911
- Publication date Mar 22, 2018
- DECA TECHNOLOGIES INC
- Craig Bishop
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD COMPRISING REDISTRIBUTION LAYERS
- Publication number 20170372964
- Publication date Dec 28, 2017
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING
- Publication number 20170256466
- Publication date Sep 7, 2017
- DECA TECHNOLOGIES INC
- Craig Bishop
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
- Publication number 20170221830
- Publication date Aug 3, 2017
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
- Publication number 20170148755
- Publication date May 25, 2017
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PACKAGE COMPRISING UNIT SPECIFIC ALIGNMENT AND UNIT SPECI...
- Publication number 20170103927
- Publication date Apr 13, 2017
- DECA TECHNOLOGIES INC
- Craig Bishop
- H01 - BASIC ELECTRIC ELEMENTS

Craig Bishop

Person

Patents Grantslast 30 patents

Molded direct contact interconnect structure without capture pads a...

Stackable fully molded semiconductor structure with through silicon...

Molded direct contact interconnect structure without capture pads a...

Method for redistribution layer (RDL) repair by mitigating at least...

Unit specific variable or adaptive metal fill and system and method...

Fully molded semiconductor structure with through silicon via (TSV)...

Multi-step high aspect ratio vertical interconnect and method of ma...

Stackable fully molded semiconductor structure with through silicon...

Fully molded bridge interposer and method of making the same

Fully molded semiconductor structure with face mounted passives and...

Stackable fully molded semiconductor structure with vertical interc...

Method of making fully molded peripheral package on package device

Semiconductor device and method of unit specific progressive alignment

Semiconductor device and method of unit specific progressive alignment

Automated optical inspection of unit specific patterning

Fully molded peripheral package on package device

Semiconductor device and method of adaptive patterning for panelize...

Multi-die package comprising unit specific alignment and unit speci...

Semiconductor device and method comprising redistribution layers

Fully molded peripheral package on package device

Semiconductor device and method comprising redistribution layers

Front side package-level serialization for packages comprising uniq...

Automated optical inspection of unit specific patterning

Semiconductor device and method of adaptive patterning for panelize...

Semiconductor device and method comprising thickened redistribution...

Semiconductor device and method of adaptive patterning for panelize...

Integrated circuit package auto-routing

Patents Applicationslast 30 patents

MOLDED DIRECT CONTACT INTERCONNECT SUBSTRATE AND METHODS OF MAKING...

STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH VERTICA...

LAYERED MOLDED DIRECT CONTACT AND DIELECTRIC STRUCTURE AND METHOD F...

UNIT SPECIFIC VARIABLE OR ADAPTIVE METAL FILL AND SYSTEM AND METHOD...

SEMICONDUCTOR ASSEMBLY COMPRISING A 3D BLOCK AND METHOD OF MAKING T...

ENCAPSULANT-DEFINED LAND GRID ARRAY (LGA) PACKAGE AND METHOD FOR MA...

METHOD FOR REDISTRIBUTION LAYER (RDL) REPAIR BY MITIGATING AT LEAST...

MOLDED DIRECT CONTACT INTERCONNECT STRUCTURE WITHOUT CAPTURE PADS A...

MOLDED DIRECT CONTACT INTERCONNECT STRUCTURE WITHOUT CAPTURE PADS A...

FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON VIA (TSV)...

STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON...

FULLY MOLDED BRIDGE INTERPOSER AND METHOD OF MAKING THE SAME

SYSTEM AND METHOD FOR REDISTRIBUTION LAYER (RDL) REPAIR

UNIT SPECIFIC VARIABLE OR ADAPTIVE METAL FILL AND SYSTEM AND METHOD...

STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON...

FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON VIA (TSV)...

FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH FACE MOUNTED PASSIVES AND...

MULTI-STEP HIGH ASPECT RATIO VERTICAL INTERCONNECT AND METHOD OF MA...

FULLY MOLDED BRIDGE INTERPOSER AND METHOD OF MAKING THE SAME

FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH FACE MOUNTED PASSIVES AND...

STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH VERTICAL INTERC...

STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH VERTICAL INTERC...

SEMICONDUCTOR DEVICE AND METHOD OF UNIT SPECIFIC PROGRESSIVE ALIGNMENT

FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF UNIT SPECIFIC PROGRESSIVE ALIGNMENT

SEMICONDUCTOR DEVICE AND METHOD COMPRISING REDISTRIBUTION LAYERS

AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING

FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE

FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE

MULTI-DIE PACKAGE COMPRISING UNIT SPECIFIC ALIGNMENT AND UNIT SPECI...