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Craig D. Gunderson
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Austin, TX, US
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last 30 patents
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Patent Grant
Conductive interconnect structure and method of formation
Patent number
5,872,385
Issue date
Feb 16, 1999
Motorola Inc.
Robert C. Taft
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of forming conductive interconnect structure
Patent number
5,441,914
Issue date
Aug 15, 1995
Motorola Inc.
Robert C. Taft
H01 - BASIC ELECTRIC ELEMENTS