Craig J. Rotay

Person

Audubon, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stress relieved thermal base for integrated circuit packaging
- Patent number 9,917,040
- Issue date Mar 13, 2018
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for pre-migration of metal ions in a semiconducto...
- Patent number 8,980,747
- Issue date Mar 17, 2015
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,853,843
- Issue date Oct 7, 2014
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,759,965
- Issue date Jun 24, 2014
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,639,373
- Issue date Jan 28, 2014
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,597,984
- Issue date Dec 3, 2013
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,560,104
- Issue date Oct 15, 2013
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for pre-migration of metal ions in a semiconductor package
- Patent number 8,557,703
- Issue date Oct 15, 2013
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,283,769
- Issue date Oct 9, 2012
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,153,474
- Issue date Apr 10, 2012
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor indicator for voltage diagnostics in power amplifiers
- Patent number 7,459,979
- Issue date Dec 2, 2008
- STMicroelectronics, Inc.
- Craig J. Rotay
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND SYSTEM FOR PRE-MIGRATION OF METAL IONS IN A SEMICONDUCTO...
- Publication number 20140077346
- Publication date Mar 20, 2014
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20120164792
- Publication date Jun 28, 2012
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20120158166
- Publication date Jun 21, 2012
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20120153391
- Publication date Jun 21, 2012
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for pre-migration of metal ions in a semiconducto...
- Publication number 20120037990
- Publication date Feb 16, 2012
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110086469
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110087356
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110084371
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110084376
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110087353
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reliability and improved frequency response package for extremely h...
- Publication number 20060255455
- Publication date Nov 16, 2006
- STMicroelectronics, Inc.
- Craig J. Rotay
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor indicator for voltage diagnostics in power amplifiers
- Publication number 20060197602
- Publication date Sep 7, 2006
- STMicroelectronics, Inc.
- Craig J. Rotay
- H03 - BASIC ELECTRONIC CIRCUITRY

Craig J. Rotay

Person

Patents Grantslast 30 patents

Stress relieved thermal base for integrated circuit packaging

Method and system for pre-migration of metal ions in a semiconducto...

Modular low stress package technology

Modular low stress package technology

Modular low stress package technology

Modular low stress package technology

Modular low stress package technology

Method for pre-migration of metal ions in a semiconductor package

Modular low stress package technology

Modular low stress package technology

Semiconductor indicator for voltage diagnostics in power amplifiers

Patents Applicationslast 30 patents

METHOD AND SYSTEM FOR PRE-MIGRATION OF METAL IONS IN A SEMICONDUCTO...

MODULAR LOW STRESS PACKAGE TECHNOLOGY

MODULAR LOW STRESS PACKAGE TECHNOLOGY

MODULAR LOW STRESS PACKAGE TECHNOLOGY

Method and system for pre-migration of metal ions in a semiconducto...

MODULAR LOW STRESS PACKAGE TECHNOLOGY

MODULAR LOW STRESS PACKAGE TECHNOLOGY

MODULAR LOW STRESS PACKAGE TECHNOLOGY

MODULAR LOW STRESS PACKAGE TECHNOLOGY

MODULAR LOW STRESS PACKAGE TECHNOLOGY

Reliability and improved frequency response package for extremely h...

Semiconductor indicator for voltage diagnostics in power amplifiers