Craig M. Kennedy

Person

San Marcos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Battery cell interconnect system
- Patent number 11,901,524
- Issue date Feb 13, 2024
- INTERPLEX INDUSTRIES, INC.
- Craig Kennedy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical assembly with a multilayer bus board
- Patent number 10,779,392
- Issue date Sep 15, 2020
- INTERPLEX INDUSTRIES, INC.
- Richard Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for filament crimping and manufacturing
- Patent number 8,939,180
- Issue date Jan 27, 2015
- Autosplice, Inc.
- Robert Bogursky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for filament crimping and manufacturing
- Patent number 8,113,243
- Issue date Feb 14, 2012
- Autosplice, Inc.
- Robert Bogursky
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus and methods for filament crimping and manufacturing
- Patent number 7,926,520
- Issue date Apr 19, 2011
- Autosplice, Inc.
- Robert Bogursky
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus and methods for filament crimping and manufacturing
- Patent number 7,650,914
- Issue date Jan 26, 2010
- Autosplice, Inc.
- Robert Bogursky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reserve transfer device and process
- Patent number 6,976,855
- Issue date Dec 20, 2005
- Auto Splice Systems Inc.
- Craig M. Kennedy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape-packaged headed pin contact
- Patent number 6,966,440
- Issue date Nov 22, 2005
- Autosplice Systems, Inc.
- Craig M. Kennedy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder reserve transfer device and process
- Patent number 6,780,028
- Issue date Aug 24, 2004
- Autosplice Systems Inc.
- Craig M. Kennedy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Discrete solder ball contact and circuit board assembly utilizing same
- Patent number 6,700,079
- Issue date Mar 2, 2004
- Autosplice, Inc.
- Robert M. Bogursky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid pin transfer assembly with common pin bias
- Patent number 6,610,253
- Issue date Aug 26, 2003
- Autosplice, Inc.
- Craig M. Kennedy
- G01 - MEASURING TESTING
Information Patent Grant
Liquid compound pin replicator with weight bias
- Patent number 6,579,499
- Issue date Jun 17, 2003
- Autosplice, Inc.
- Craig M. Kennedy
- G01 - MEASURING TESTING
Information Patent Grant
Hybrid solder ball and pin grid array circuit board interconnect sy...
- Patent number 6,272,741
- Issue date Aug 14, 2001
- Autosplice, Inc.
- Craig M. Kennedy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BATTERY CELL INTERCONNECT SYSTEM
- Publication number 20210391602
- Publication date Dec 16, 2021
- Interplex Industries, Inc.
- Craig Kennedy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL ASSEMBLY WITH A MULTILAYER BUS BOARD
- Publication number 20200060022
- Publication date Feb 20, 2020
- Interplex Industries, Inc.
- Richard Schneider
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHODS FOR FILAMENT CRIMPING AND MANUFACTURING
- Publication number 20120261025
- Publication date Oct 18, 2012
- Robert Bogursky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR FILAMENT CRIMPING AND MANUFACTURING
- Publication number 20110000577
- Publication date Jan 6, 2011
- Robert Bogursky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR FILAMENT CRIMPING AND MANUFACTURING
- Publication number 20100119863
- Publication date May 13, 2010
- Robert Bogursky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and methods for filament crimping and manufacturing
- Publication number 20070294873
- Publication date Dec 27, 2007
- Robert Bogursky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder reserve transfer device and process
- Publication number 20040209495
- Publication date Oct 21, 2004
- Autosplice Systems Inc.
- Craig M. Kennedy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Discrete solder ball contact and circuit board assembly utilizing same
- Publication number 20030079911
- Publication date May 1, 2003
- Robert M. Bogursky
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Header for surface mount between parallel circuit boards
- Publication number 20030080174
- Publication date May 1, 2003
- Craig M. Kennedy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid pin transfer assembly with common pin bias
- Publication number 20010049149
- Publication date Dec 6, 2001
- Craig M. Kennedy
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL

Craig M. Kennedy

Person

Patents Grantslast 30 patents

Battery cell interconnect system

Electrical assembly with a multilayer bus board

Apparatus and methods for filament crimping and manufacturing

Apparatus and methods for filament crimping and manufacturing

Apparatus and methods for filament crimping and manufacturing

Apparatus and methods for filament crimping and manufacturing

Solder reserve transfer device and process

Tape-packaged headed pin contact

Solder reserve transfer device and process

Discrete solder ball contact and circuit board assembly utilizing same

Liquid pin transfer assembly with common pin bias

Liquid compound pin replicator with weight bias

Hybrid solder ball and pin grid array circuit board interconnect sy...

Patents Applicationslast 30 patents

BATTERY CELL INTERCONNECT SYSTEM

ELECTRICAL ASSEMBLY WITH A MULTILAYER BUS BOARD

APPARATUS AND METHODS FOR FILAMENT CRIMPING AND MANUFACTURING

APPARATUS AND METHODS FOR FILAMENT CRIMPING AND MANUFACTURING

APPARATUS AND METHODS FOR FILAMENT CRIMPING AND MANUFACTURING

Apparatus and methods for filament crimping and manufacturing

Solder reserve transfer device and process

Discrete solder ball contact and circuit board assembly utilizing same

Header for surface mount between parallel circuit boards

Liquid pin transfer assembly with common pin bias