Craig M. Randleman

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Firecrest, WA, US

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Patents Grantslast 30 patents

Information Patent Grant
High performance air cooled heat sinks used in high density packagi...
- Patent number 6,479,895
- Issue date Nov 12, 2002
- Intel Corporation
- Seri Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization removal under the laser mark area for substrates
- Patent number 6,403,891
- Issue date Jun 11, 2002
- Intel Corporation
- Koushik Banerjee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HIGH PERFORMANCE AIR COOLED HEAT SINKS USED IN HIGH DENSITY PACKAGI...
- Publication number 20020171139
- Publication date Nov 21, 2002
- Intel Corporation
- Seri Lee
- H01 - BASIC ELECTRIC ELEMENTS