Craig Mitchell

Person

Huntington Beach, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Mobility as a service (MaaS) with modular interiors
- Patent number 11,186,217
- Issue date Nov 30, 2021
- Honda Motor Co., Ltd.
- Geoffrey Woo Honda
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power hop anticipation and mitigation
- Patent number 10,926,771
- Issue date Feb 23, 2021
- ZF Active Safety US Inc.
- Dustin S. Kang
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Cavities containing multi-wiring structures and devices
- Patent number 10,813,214
- Issue date Oct 20, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic elements with post-assembly planarization
- Patent number 10,559,494
- Issue date Feb 11, 2020
- Tessera, Inc.
- Vage Oganesian
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Warpage balancing in thin packages
- Patent number 10,483,217
- Issue date Nov 19, 2019
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Staged via formation from both sides of chip
- Patent number 10,354,942
- Issue date Jul 16, 2019
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active chip on carrier or laminated chip having microelectronic ele...
- Patent number 10,262,947
- Issue date Apr 16, 2019
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable packaging and interconnect structures
- Patent number 10,037,940
- Issue date Jul 31, 2018
- Tessera, Inc.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavities containing multi-wiring structures and devices
- Patent number 10,015,881
- Issue date Jul 3, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage balancing in thin packages
- Patent number 9,972,582
- Issue date May 15, 2018
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic elements with post-assembly planarization
- Patent number 9,966,303
- Issue date May 8, 2018
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated chip having microelectronic element embedded therein
- Patent number 9,859,220
- Issue date Jan 2, 2018
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vehicle traction control based driveline thermal protection
- Patent number 9,845,091
- Issue date Dec 19, 2017
- GM Global Technology Operations LLC
- James J. Greene
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Staged via formation from both sides of chip
- Patent number 9,847,277
- Issue date Dec 19, 2017
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable packaging and interconnect structures
- Patent number 9,711,401
- Issue date Jul 18, 2017
- Tessera, Inc.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of traction control for a motor vehicle
- Patent number 9,707,967
- Issue date Jul 18, 2017
- Kelsey-Hayes Company
- Patrick A. Hartman
- B60 - VEHICLES IN GENERAL
Information Patent Grant
System for alerting a driver and method thereof
- Patent number 9,669,758
- Issue date Jun 6, 2017
- Honda Motor Co., Ltd.
- Zeljko Medenica
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Microelectronic elements with post-assembly planarization
- Patent number 9,659,812
- Issue date May 23, 2017
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor elements using micro-abrasive part...
- Patent number 9,640,437
- Issue date May 2, 2017
- Tessera, Inc.
- Vage Oganesian
- B24 - GRINDING POLISHING
Information Patent Grant
Connector structures and methods
- Patent number 9,634,412
- Issue date Apr 25, 2017
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic assembly with TSVS formed in stages and car...
- Patent number 9,620,437
- Issue date Apr 11, 2017
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked packaging improvements
- Patent number 9,570,416
- Issue date Feb 14, 2017
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical barrier layers
- Patent number 9,560,773
- Issue date Jan 31, 2017
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable packaging and interconnect structures
- Patent number 9,385,036
- Issue date Jul 5, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic assembly with TSVs formed in stages with pl...
- Patent number 9,368,476
- Issue date Jun 14, 2016
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staged via formation from both sides of chip
- Patent number 9,362,203
- Issue date Jun 7, 2016
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-function and shielded 3D interconnects
- Patent number 9,355,948
- Issue date May 31, 2016
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-lithographic formation of three-dimensional conductive elements
- Patent number 9,355,901
- Issue date May 31, 2016
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active chip on carrier or laminated chip having microelectronic ele...
- Patent number 9,355,959
- Issue date May 31, 2016
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced stress TSV and interposer structures
- Patent number 9,349,669
- Issue date May 24, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOBILITY AS A SERVICE (MaaS) WITH MODULAR INTERIORS
- Publication number 20210070216
- Publication date Mar 11, 2021
- Honda Motor Co., Ltd.
- Geoffrey Woo Honda
- B60 - VEHICLES IN GENERAL
Information Patent Application
VEHICLE BRAKE SYSTEM USING ELECTRIC PARKING BRAKE IN FAILED BOOST C...
- Publication number 20200023825
- Publication date Jan 23, 2020
- ZF Active Safety US Inc.
- Craig Mitchell
- B60 - VEHICLES IN GENERAL
Information Patent Application
Power Hop Anticipation and Mitigation
- Publication number 20190225226
- Publication date Jul 25, 2019
- KELSEY-HAYES COMPANY
- Dustin S. Kang
- B60 - VEHICLES IN GENERAL
Information Patent Application
Cavities Containing Multi-wiring Structures And Devices
- Publication number 20180295718
- Publication date Oct 11, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Balancing In Thin Packages
- Publication number 20180261556
- Publication date Sep 13, 2018
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION
- Publication number 20180254213
- Publication date Sep 6, 2018
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE CHIP ON CARRIER OR LAMINATED CHIP HAVING MICROELECTRONIC ELE...
- Publication number 20180130746
- Publication date May 10, 2018
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGED VIA FORMATION FROM BOTH SIDES OF CHIP
- Publication number 20180114743
- Publication date Apr 26, 2018
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Balancing in Thin Packages
- Publication number 20180040572
- Publication date Feb 8, 2018
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VEHICLE TRACTION CONTROL BASED DRIVELINE THERMAL PROTECTION
- Publication number 20170320487
- Publication date Nov 9, 2017
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- James J. Greene
- B60 - VEHICLES IN GENERAL
Information Patent Application
Reliable packaging and interconnect structures
- Publication number 20170294376
- Publication date Oct 12, 2017
- Tessera, Inc.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION
- Publication number 20170256443
- Publication date Sep 7, 2017
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VEHICLE LIGHTING ASSEMBLY AND METHOD
- Publication number 20170167680
- Publication date Jun 15, 2017
- Honda Motor Co., Ltd.
- Craig Mitchell
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRICAL BARRIER LAYERS
- Publication number 20170098621
- Publication date Apr 6, 2017
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR ALERTING A DRIVER AND METHOD THEREOF
- Publication number 20170028911
- Publication date Feb 2, 2017
- Honda Motor Co., Ltd.
- Zeljko Medenica
- B60 - VEHICLES IN GENERAL
Information Patent Application
METHOD OF TRACTION CONTROL FOR A MOTOR VEHICLE
- Publication number 20170001644
- Publication date Jan 5, 2017
- KELSEY-HAYES COMPANY
- Patrick A. Hartman
- B60 - VEHICLES IN GENERAL
Information Patent Application
RELIABLE PACKAGING AND INTERCONNECT STRUCTURES
- Publication number 20160307798
- Publication date Oct 20, 2016
- Tessera, Inc.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Staged via formation from both sides of chip
- Publication number 20160284627
- Publication date Sep 29, 2016
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE CHIP ON CARRIER OR LAMINATED CHIP HAVING MICROELECTRONIC ELE...
- Publication number 20160233165
- Publication date Aug 11, 2016
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES AND CAR...
- Publication number 20160163620
- Publication date Jun 9, 2016
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGING IMPROVEMENTS
- Publication number 20160035692
- Publication date Feb 4, 2016
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL BARRIER LAYERS
- Publication number 20150334829
- Publication date Nov 19, 2015
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES WITH PL...
- Publication number 20150333050
- Publication date Nov 19, 2015
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE EXPOSURE IN MULTI-DAMASCENE PROCESS
- Publication number 20150279730
- Publication date Oct 1, 2015
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION
- Publication number 20150249037
- Publication date Sep 3, 2015
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-LITHOGRAPHIC FORMATION OF THREE-DIMENSIONAL CONDUCTIVE ELEMENTS
- Publication number 20150221551
- Publication date Aug 6, 2015
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED STRESS TSV AND INTERPOSER STRUCTURES
- Publication number 20150187673
- Publication date Jul 2, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGED VIA FORMATION FROM BOTH SIDES OF CHIP
- Publication number 20150130077
- Publication date May 14, 2015
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITIES CONTAINING MULTI-WIRING STRUCTURES AND DEVICES
- Publication number 20150101858
- Publication date Apr 16, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGING IMPROVEMENTS
- Publication number 20150102508
- Publication date Apr 16, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Craig Mitchell

Person

Patents Grantslast 30 patents

Mobility as a service (MaaS) with modular interiors

Power hop anticipation and mitigation

Cavities containing multi-wiring structures and devices

Microelectronic elements with post-assembly planarization

Warpage balancing in thin packages

Staged via formation from both sides of chip

Active chip on carrier or laminated chip having microelectronic ele...

Reliable packaging and interconnect structures

Cavities containing multi-wiring structures and devices

Warpage balancing in thin packages

Microelectronic elements with post-assembly planarization

Laminated chip having microelectronic element embedded therein

Vehicle traction control based driveline thermal protection

Staged via formation from both sides of chip

Reliable packaging and interconnect structures

Method of traction control for a motor vehicle

System for alerting a driver and method thereof

Microelectronic elements with post-assembly planarization

Methods of forming semiconductor elements using micro-abrasive part...

Connector structures and methods

Stacked microelectronic assembly with TSVS formed in stages and car...

Stacked packaging improvements

Electrical barrier layers

Reliable packaging and interconnect structures

Stacked microelectronic assembly with TSVs formed in stages with pl...

Staged via formation from both sides of chip

Multi-function and shielded 3D interconnects

Non-lithographic formation of three-dimensional conductive elements

Active chip on carrier or laminated chip having microelectronic ele...

Reduced stress TSV and interposer structures

Patents Applicationslast 30 patents

MOBILITY AS A SERVICE (MaaS) WITH MODULAR INTERIORS

VEHICLE BRAKE SYSTEM USING ELECTRIC PARKING BRAKE IN FAILED BOOST C...

Power Hop Anticipation and Mitigation

Cavities Containing Multi-wiring Structures And Devices

Warpage Balancing In Thin Packages

MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION

ACTIVE CHIP ON CARRIER OR LAMINATED CHIP HAVING MICROELECTRONIC ELE...

STAGED VIA FORMATION FROM BOTH SIDES OF CHIP

Warpage Balancing in Thin Packages

VEHICLE TRACTION CONTROL BASED DRIVELINE THERMAL PROTECTION

Reliable packaging and interconnect structures

MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION

VEHICLE LIGHTING ASSEMBLY AND METHOD

ELECTRICAL BARRIER LAYERS

SYSTEM FOR ALERTING A DRIVER AND METHOD THEREOF

METHOD OF TRACTION CONTROL FOR A MOTOR VEHICLE

RELIABLE PACKAGING AND INTERCONNECT STRUCTURES

Staged via formation from both sides of chip

ACTIVE CHIP ON CARRIER OR LAMINATED CHIP HAVING MICROELECTRONIC ELE...

STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES AND CAR...

STACKED PACKAGING IMPROVEMENTS

ELECTRICAL BARRIER LAYERS

STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES WITH PL...

SINGLE EXPOSURE IN MULTI-DAMASCENE PROCESS

MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION

NON-LITHOGRAPHIC FORMATION OF THREE-DIMENSIONAL CONDUCTIVE ELEMENTS

REDUCED STRESS TSV AND INTERPOSER STRUCTURES

STAGED VIA FORMATION FROM BOTH SIDES OF CHIP

CAVITIES CONTAINING MULTI-WIRING STRUCTURES AND DEVICES

STACKED PACKAGING IMPROVEMENTS