Craig S. Amrine

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for singulating electronic components from a substrate
- Patent number 9,142,434
- Issue date Sep 22, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Wei Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging an integrated circuit die with backside metallization
- Patent number 8,236,609
- Issue date Aug 7, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Lakshmi N. Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible carrier for high volume electronic package fabrication
- Patent number 7,969,026
- Issue date Jun 28, 2011
- FREESCALE SEMICONDUCTOR, INC.
- William H. Lytle
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic assembly manufacturing method
- Patent number 7,802,359
- Issue date Sep 28, 2010
- FREESCALE SEMICONDUCTOR, INC.
- William H. Lytle
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit package formation
- Patent number 7,741,151
- Issue date Jun 22, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Craig S. Amrine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible carrier and release method for high volume electronic pack...
- Patent number 7,442,581
- Issue date Oct 28, 2008
- FREESCALE SEMICONDUCTOR, INC.
- William H. Lytle
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Methods and apparatus for thermal management in a multi-layer embed...
- Patent number 7,405,102
- Issue date Jul 29, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Tien Yu T. Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die encapsulation using a porous carrier
- Patent number 7,015,075
- Issue date Mar 21, 2006
- Freescale Semiconuctor, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level MEMS packaging
- Patent number 6,953,985
- Issue date Oct 11, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Jong-Kai Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Seal and method of sealing devices such as displays
- Patent number 6,459,198
- Issue date Oct 1, 2002
- Motorola, Inc.
- Kenneth A. Dean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a field emission display having a spacer wit...
- Patent number 6,366,009
- Issue date Apr 2, 2002
- Motorola, Inc.
- Peter A. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making field emission display having a mechanical support...
- Patent number 6,149,484
- Issue date Nov 21, 2000
- Motorola, Inc.
- Craig Amrine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field emission device having stamped substrate and method
- Patent number 6,114,802
- Issue date Sep 5, 2000
- Motorola, Inc.
- Craig Amrine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for affixing spacers in a field emission display
- Patent number 6,042,445
- Issue date Mar 28, 2000
- Motorola, Inc.
- Craig Amrine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field emission device having a non-coated spacer
- Patent number 5,990,613
- Issue date Nov 23, 1999
- Motorola, Inc.
- Scott K. Ageno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a display spacer assembly
- Patent number 5,980,346
- Issue date Nov 9, 1999
- Motorola, Inc.
- Clifford L. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Node plate for field emission display
- Patent number 5,945,780
- Issue date Aug 31, 1999
- Motorola, Inc.
- Arthur J. Ingle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field emission display with getter frame and spacer-frame assembly
- Patent number 5,894,193
- Issue date Apr 13, 1999
- Motorola Inc.
- Craig Amrine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacers for a flat panel display and method
- Patent number 5,717,287
- Issue date Feb 10, 1998
- Motorola
- Craig Amrine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display spacer structure for a field emission device
- Patent number 5,708,325
- Issue date Jan 13, 1998
- Motorola
- Clifford L. Anderson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SINGULATING ELECTRONIC COMPONENTS FROM A SUBSTRATE
- Publication number 20110217814
- Publication date Sep 8, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Wei Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE FORMATION
- Publication number 20100112756
- Publication date May 6, 2010
- Craig S. Amrine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING AN INTEGRATED CIRCUIT DIE WITH BACKSIDE METALLIZATION
- Publication number 20100029045
- Publication date Feb 4, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Lakshmi N. Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY MANUFACTURING METHOD
- Publication number 20090165293
- Publication date Jul 2, 2009
- FREESCALE SEMICONDUCTOR, INC.
- William H. Lytle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CARRIER FOR HIGH VOLUME ELECTRONIC PACKAGE FABRICATION
- Publication number 20090008802
- Publication date Jan 8, 2009
- FREESCALE SEMICONDUCTOR, INC.
- William H. Lytle
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR FORMING A MICROELECTRONIC ASSEMBLY INCLUDING ENCAPSULATI...
- Publication number 20080182363
- Publication date Jul 31, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Craig S. Amrine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for thermal management in a multi-layer embed...
- Publication number 20070284711
- Publication date Dec 13, 2007
- Tien Yu T. Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for planarizing vias formed in a substrate
- Publication number 20070212865
- Publication date Sep 13, 2007
- Craig Amrine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible carrier and release method for high volume electronic pack...
- Publication number 20060128066
- Publication date Jun 15, 2006
- William H. Lytle
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Die encapsulation using a porous carrier
- Publication number 20050176180
- Publication date Aug 11, 2005
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS control chip integration
- Publication number 20040016995
- Publication date Jan 29, 2004
- Shun Meen Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level MEMS packaging
- Publication number 20030230798
- Publication date Dec 18, 2003
- Jong-Kai Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Craig S. Amrine

Person

Patents Grantslast 30 patents

Method for singulating electronic components from a substrate

Packaging an integrated circuit die with backside metallization

Flexible carrier for high volume electronic package fabrication

Electronic assembly manufacturing method

Integrated circuit package formation

Flexible carrier and release method for high volume electronic pack...

Methods and apparatus for thermal management in a multi-layer embed...

Die encapsulation using a porous carrier

Wafer level MEMS packaging

Seal and method of sealing devices such as displays

Method for fabricating a field emission display having a spacer wit...

Method of making field emission display having a mechanical support...

Field emission device having stamped substrate and method

Method for affixing spacers in a field emission display

Field emission device having a non-coated spacer

Method for fabricating a display spacer assembly

Node plate for field emission display

Field emission display with getter frame and spacer-frame assembly

Spacers for a flat panel display and method

Display spacer structure for a field emission device

Patents Applicationslast 30 patents

METHOD FOR SINGULATING ELECTRONIC COMPONENTS FROM A SUBSTRATE

INTEGRATED CIRCUIT PACKAGE FORMATION

PACKAGING AN INTEGRATED CIRCUIT DIE WITH BACKSIDE METALLIZATION

ELECTRONIC ASSEMBLY MANUFACTURING METHOD

FLEXIBLE CARRIER FOR HIGH VOLUME ELECTRONIC PACKAGE FABRICATION

METHOD FOR FORMING A MICROELECTRONIC ASSEMBLY INCLUDING ENCAPSULATI...

Methods and apparatus for thermal management in a multi-layer embed...

Method for planarizing vias formed in a substrate

Flexible carrier and release method for high volume electronic pack...

Die encapsulation using a porous carrier

MEMS control chip integration

Wafer level MEMS packaging