Craig T. Clyne

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Die attached to a support member by a plurality of adhesive members
- Patent number 9,064,973
- Issue date Jun 23, 2015
- Micron Technology, Inc.
- Craig T. Clyne
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods of adhering microfeature workpieces, including a chip, to a...
- Patent number 8,278,751
- Issue date Oct 2, 2012
- Micron Technology, Inc.
- Craig T. Clyne
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Microfeature systems including adhered microfeature workpieces and...
- Patent number 7,518,237
- Issue date Apr 14, 2009
- Micron Technology, Inc.
- Craig T. Clyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Patent number 6,921,017
- Issue date Jul 26, 2005
- Micron Technology, Inc.
- Sven Evers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wire bond machine leadframe thermal map system
- Patent number 6,652,138
- Issue date Nov 25, 2003
- Micron Technology, Inc.
- Craig T. Clyne
- G01 - MEASURING TESTING
Information Patent Grant
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Patent number 6,634,538
- Issue date Oct 21, 2003
- Micron Technology, Inc.
- Sven Evers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Patent number 6,588,649
- Issue date Jul 8, 2003
- Micron Technology, Inc.
- Sven Evers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wirebond machine leadframe thermal map system
- Patent number 6,447,162
- Issue date Sep 10, 2002
- Micron Technology, Inc.
- Craig T. Clyne
- G01 - MEASURING TESTING
Information Patent Grant
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Patent number 6,375,061
- Issue date Apr 23, 2002
- Micron Technology, Inc.
- Sven Evers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Patent number 6,352,191
- Issue date Mar 5, 2002
- Micron Technology, Inc.
- Sven Evers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wirebond machine leadframe thermal map system
- Patent number 6,273,605
- Issue date Aug 14, 2001
- Micron Technology, Inc.
- Craig T. Clyne
- G01 - MEASURING TESTING
Information Patent Grant
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Patent number 6,138,891
- Issue date Oct 31, 2000
- Micron Technology, Inc.
- Sven Evers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Patent number 6,126,062
- Issue date Oct 3, 2000
- Micron Technology, Inc.
- Sven Evers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Patent number 6,105,846
- Issue date Aug 22, 2000
- Micron Technology, Inc.
- Sven Evers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wirebond machine leadframe thermal map system
- Patent number 6,071,009
- Issue date Jun 6, 2000
- Micron Technology, Inc.
- Craig T. Clyne
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND SYSTEMS FOR ADHERING MICROFEATURE WORKPIECES TO SUPPORT...
- Publication number 20130000842
- Publication date Jan 3, 2013
- Micron Technology, Inc.
- Craig T. Clyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and systems for adhering microfeature workpieces to support...
- Publication number 20060189036
- Publication date Aug 24, 2006
- Micron Technology, Inc.
- Craig T. Clyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Adhering Microfeature Workpieces, Including A Chip, To A...
- Publication number 20060177970
- Publication date Aug 10, 2006
- Micron Technology, Inc.
- Craig T. Clyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Publication number 20040026486
- Publication date Feb 12, 2004
- Sven Evers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor wirebond machine leadframe thermal map system
- Publication number 20020181538
- Publication date Dec 5, 2002
- Craig T. Clyne
- G01 - MEASURING TESTING
Information Patent Application
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Publication number 20020066775
- Publication date Jun 6, 2002
- Sven Evers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Publication number 20020043548
- Publication date Apr 18, 2002
- Sven Evers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wirebond machine leadframe thermal map system
- Publication number 20010033598
- Publication date Oct 25, 2001
- Craig T. Clyne
- G01 - MEASURING TESTING

Craig T. Clyne

Person

Patents Grantslast 30 patents

Die attached to a support member by a plurality of adhesive members

Methods of adhering microfeature workpieces, including a chip, to a...

Microfeature systems including adhered microfeature workpieces and...

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Semiconductor wire bond machine leadframe thermal map system

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Semiconductor wirebond machine leadframe thermal map system

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Semiconductor wirebond machine leadframe thermal map system

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Semiconductor wirebond machine leadframe thermal map system

Patents Applicationslast 30 patents

METHODS AND SYSTEMS FOR ADHERING MICROFEATURE WORKPIECES TO SUPPORT...

Methods and systems for adhering microfeature workpieces to support...

Methods of Adhering Microfeature Workpieces, Including A Chip, To A...

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Semiconductor wirebond machine leadframe thermal map system

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Semiconductor wirebond machine leadframe thermal map system