Crispulo E. Lictao

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer dicing method
- Patent number 10,297,500
- Issue date May 21, 2019
- Nexperia B.V.
- Crispulo Estira Lictao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 6,680,545
- Issue date Jan 20, 2004
- Koninklijke Philips Electronics N.V.
- Merlyn P. Young
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER DICING METHOD
- Publication number 20180174907
- Publication date Jun 21, 2018
- Nexperia B.V.
- Crispulo Estira Lictao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices
- Publication number 20020036355
- Publication date Mar 28, 2002
- Koninklijke Philips Electronics N.V.
- Merlyn P. Young
- H01 - BASIC ELECTRIC ELEMENTS