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Patents Grantslast 30 patents

Information Patent Grant
Shielded electronic package and method of fabrication
- Patent number 11,482,478
- Issue date Oct 25, 2022
- NXP B.V.
- Crispulo Estira Lictao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH EMBEDDED BATTERY AND METHOD THEREFOR
- Publication number 20230343683
- Publication date Oct 26, 2023
- NXP USA, Inc.
- Stephen Ryan Hooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED ELECTRONIC PACKAGE AND METHOD OF FABRICATION
- Publication number 20220028766
- Publication date Jan 27, 2022
- NXP B.V.
- Crispulo Estira Lictao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEDGE-BONDING OF WIRES IN ELECTRONIC DEVICE MANUFACTURE WITH REVERS...
- Publication number 20080272176
- Publication date Nov 6, 2008
- NXP B.V.
- RAMIL N. VASQUEZ
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR