Cunyu Yang

Person

Milpitas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Pixel, associated image sensor, and method
- Patent number 11,843,019
- Issue date Dec 12, 2023
- Omni Vision Technologies, Inc.
- Hui Zang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully buried color filter array of image sensor
- Patent number 11,750,906
- Issue date Sep 5, 2023
- OmniVision Technologies, Inc.
- Gang Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Cell deep trench isolation structure for near infrared improvement
- Patent number 11,335,718
- Issue date May 17, 2022
- OmniVision Technologies, Inc.
- Hui Zang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully buried color filter array of image sensor
- Patent number 11,245,823
- Issue date Feb 8, 2022
- OmniVision Technologies, Inc.
- Gang Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Light control for improved near infrared sensitivity and channel se...
- Patent number 10,964,744
- Issue date Mar 30, 2021
- OmniVision Technologies, Inc.
- Cheng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having a source follower transistor with a multi-thick...
- Patent number 10,964,738
- Issue date Mar 30, 2021
- OmniVision Technologies, Inc.
- Gang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS image sensor having enhanced near infrared quantum efficiency...
- Patent number 10,224,364
- Issue date Mar 5, 2019
- OmniVision Technologies, Inc.
- Cheng Zhao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Backside illuminated image sensor with improved contact area
- Patent number 10,147,754
- Issue date Dec 4, 2018
- OmniVision Technologies, Inc.
- Dyson H. Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS image sensor having enhanced near infrared quantum efficiency
- Patent number 9,991,309
- Issue date Jun 5, 2018
- OmniVision Technologies, Inc.
- Cunyu Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Isolation structure in photodiode
- Patent number 9,799,696
- Issue date Oct 24, 2017
- OmniVision Technologies, Inc.
- Dyson H. Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with dielectric charge trapping device
- Patent number 9,312,299
- Issue date Apr 12, 2016
- OmniVision Technologies, Inc.
- Oray Orkun Cellek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die seal ring for integrated circuit system with stacked device wafers
- Patent number 9,305,968
- Issue date Apr 5, 2016
- OmniVision Technologies, Inc.
- Yin Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die seal ring for integrated circuit system with stacked device wafers
- Patent number 9,142,581
- Issue date Sep 22, 2015
- OmniVision Technologies, Inc.
- Yin Qian
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FULLY BURIED COLOR FILTER ARRAY OF IMAGE SENSOR
- Publication number 20220116516
- Publication date Apr 14, 2022
- OMNIVISION TECHNOLOGIES, INC.
- Gang Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CELL DEEP TRENCH ISOLATION STRUCTURE FOR NEAR INFRARED IMPROVEMENT
- Publication number 20220020790
- Publication date Jan 20, 2022
- OMNIVISION TECHNOLOGIES, INC.
- Hui ZANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PIXEL, ASSOCIATED IMAGE SENSOR, AND METHOD
- Publication number 20210151494
- Publication date May 20, 2021
- OMNIVISION TECHNOLOGIES, INC.
- Hui ZANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT CONTROL FOR IMPROVED NEAR INFRARED SENSITIVITY AND CHANNEL SE...
- Publication number 20210082990
- Publication date Mar 18, 2021
- OMNIVISION TECHNOLOGIES, INC.
- Cheng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY BURIED COLOR FILTER ARRAY OF IMAGE SENSOR
- Publication number 20210051250
- Publication date Feb 18, 2021
- OMNIVISION TECHNOLOGIES, INC.
- Gang Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MULTI-THICKNESS GATE DIELECTRIC
- Publication number 20200105807
- Publication date Apr 2, 2020
- OMNIVISION TECHNOLOGIES, INC.
- Gang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR HAVING ENHANCED NEAR INFRARED QUANTUM EFFICIENCY...
- Publication number 20190019832
- Publication date Jan 17, 2019
- OMNIVISION TECHNOLOGIES, INC.
- Cheng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE ILLUMINATED IMAGE SENSOR WITH IMPROVED CONTACT AREA
- Publication number 20180240833
- Publication date Aug 23, 2018
- OMNIVISION TECHNOLOGIES, INC.
- Dyson H. Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SEAL RING FOR INTEGRATED CIRCUIT SYSTEM WITH STACKED DEVICE WAFERS
- Publication number 20150349004
- Publication date Dec 3, 2015
- OMNIVISION TECHNOLOGIES, INC.
- Yin Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH DIELECTRIC CHARGE TRAPPING DEVICE
- Publication number 20150295007
- Publication date Oct 15, 2015
- OMNIVISION TECHNOLOGIES, INC.
- Oray Orkun Cellek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SEAL RING FOR INTEGRATED CIRCUIT SYSTEM WITH STACKED DEVICE WAFERS
- Publication number 20140124889
- Publication date May 8, 2014
- OMNIVISION TECHNOLOGIES, INC.
- Yin Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SOURCE FOLLOWER PIXEL CELL ARCHITECTURE
- Publication number 20130256509
- Publication date Oct 3, 2013
- OMNIVISION TECHNOLOGIES, INC.
- Cunyu Yang
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Pixel, associated image sensor, and method

Fully buried color filter array of image sensor

Cell deep trench isolation structure for near infrared improvement

Fully buried color filter array of image sensor

Light control for improved near infrared sensitivity and channel se...

Image sensor having a source follower transistor with a multi-thick...

CMOS image sensor having enhanced near infrared quantum efficiency...

Backside illuminated image sensor with improved contact area

CMOS image sensor having enhanced near infrared quantum efficiency

Isolation structure in photodiode

Image sensor with dielectric charge trapping device

Die seal ring for integrated circuit system with stacked device wafers

Die seal ring for integrated circuit system with stacked device wafers

Patents Applicationslast 30 patents

FULLY BURIED COLOR FILTER ARRAY OF IMAGE SENSOR

CELL DEEP TRENCH ISOLATION STRUCTURE FOR NEAR INFRARED IMPROVEMENT

PIXEL, ASSOCIATED IMAGE SENSOR, AND METHOD

LIGHT CONTROL FOR IMPROVED NEAR INFRARED SENSITIVITY AND CHANNEL SE...

FULLY BURIED COLOR FILTER ARRAY OF IMAGE SENSOR

MULTI-THICKNESS GATE DIELECTRIC

CMOS IMAGE SENSOR HAVING ENHANCED NEAR INFRARED QUANTUM EFFICIENCY...

BACKSIDE ILLUMINATED IMAGE SENSOR WITH IMPROVED CONTACT AREA

DIE SEAL RING FOR INTEGRATED CIRCUIT SYSTEM WITH STACKED DEVICE WAFERS

IMAGE SENSOR WITH DIELECTRIC CHARGE TRAPPING DEVICE

DIE SEAL RING FOR INTEGRATED CIRCUIT SYSTEM WITH STACKED DEVICE WAFERS

DUAL SOURCE FOLLOWER PIXEL CELL ARCHITECTURE