Curtis H. Rahn

Person

Plymouth, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated SOI pressure sensor having silicon stress isolation member
- Patent number 10,151,647
- Issue date Dec 11, 2018
- Honeywell International Inc.
- Gregory C. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and processes for silicon on insulator MEMS pressure sensors
- Patent number 8,813,580
- Issue date Aug 26, 2014
- Honeywell International Inc.
- Gregory C. Brown
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic pH sensor die packaging
- Patent number 8,536,626
- Issue date Sep 17, 2013
- Honeywell International Inc.
- Gregory C. Brown
- G01 - MEASURING TESTING
Information Patent Grant
Modular pressure sensor
- Patent number 8,065,917
- Issue date Nov 29, 2011
- Honeywell International Inc.
- Gregory C. Brown
- G01 - MEASURING TESTING
Information Patent Grant
Pressure-sensor apparatus
- Patent number 7,698,951
- Issue date Apr 20, 2010
- Honeywell International Inc.
- Gregory C. Brown
- G01 - MEASURING TESTING
Information Patent Grant
Isolation scheme for reducing film stress in a MEMS device
- Patent number 7,514,285
- Issue date Apr 7, 2009
- Honeywell International Inc.
- Gregory C. Brown
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and structure of ion implanted elements for the optimization...
- Patent number 7,381,582
- Issue date Jun 3, 2008
- Honeywell International Inc.
- Russell L. Johnson
- G01 - MEASURING TESTING
Information Patent Grant
Microelectromechanical device with integrated conductive shield
- Patent number 6,952,042
- Issue date Oct 4, 2005
- Honeywell International, Inc.
- Thomas G. Stratton
- G01 - MEASURING TESTING
Information Patent Grant
Radiation hardened field oxide for VLSI sub-micron MOS device
- Patent number 6,225,178
- Issue date May 1, 2001
- Honeywell Inc.
- Gordon A. Shaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming variable width isolation structures
- Patent number 5,234,861
- Issue date Aug 10, 1993
- Honeywell Inc.
- Roger L. Roisen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming variable width isolation structures
- Patent number 5,017,999
- Issue date May 21, 1991
- Honeywell Inc.
- Roger L. Roisen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED SOI PRESSURE SENSOR HAVING SILICON STRESS ISOLATION MEMBER
- Publication number 20140374846
- Publication date Dec 25, 2014
- Gregory C. Brown
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS AND PROCESSES FOR SILICON ON INSULATOR MEMS PRESSURE SENSORS
- Publication number 20130228022
- Publication date Sep 5, 2013
- Honeywell International Inc.
- Gregory C. Brown
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC PH SENSOR DIE PACKAGING
- Publication number 20120273845
- Publication date Nov 1, 2012
- Honeywell International Inc.
- Gregory C. Brown
- G01 - MEASURING TESTING
Information Patent Application
MODULAR PRESSURE SENSOR
- Publication number 20110283802
- Publication date Nov 24, 2011
- Honeywell International Inc.
- Gregory C. Brown
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE-SENSOR APPARATUS
- Publication number 20090293628
- Publication date Dec 3, 2009
- Honeywell International Inc.
- Gregory C. Brown
- G01 - MEASURING TESTING
Information Patent Application
SILICON PRESSURE SENSOR
- Publication number 20090120194
- Publication date May 14, 2009
- Honeywell International Inc.
- Curtis H. Rahn
- G01 - MEASURING TESTING
Information Patent Application
Microelectromechanical device with integrated conductive shield
- Publication number 20070243654
- Publication date Oct 18, 2007
- Honeywell International Inc.
- Thomas G. Stratton
- G01 - MEASURING TESTING
Information Patent Application
Isolation scheme for reducing film stress in a MEMS device
- Publication number 20070164379
- Publication date Jul 19, 2007
- Honeywell International Inc.
- Gregory C. Brown
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and structure of ion implanted elements for the optimization...
- Publication number 20070111355
- Publication date May 17, 2007
- Honeywell International Inc.
- Russell L. Johnson
- G01 - MEASURING TESTING
Information Patent Application
Microelectromechanical device with integrated conductive shield
- Publication number 20030230147
- Publication date Dec 18, 2003
- Honeywell International Inc.
- Thomas G. Stratton
- G01 - MEASURING TESTING

Curtis H. Rahn

Person

Patents Grantslast 30 patents

Integrated SOI pressure sensor having silicon stress isolation member

Apparatus and processes for silicon on insulator MEMS pressure sensors

Electronic pH sensor die packaging

Modular pressure sensor

Pressure-sensor apparatus

Isolation scheme for reducing film stress in a MEMS device

Method and structure of ion implanted elements for the optimization...

Microelectromechanical device with integrated conductive shield

Radiation hardened field oxide for VLSI sub-micron MOS device

Method for forming variable width isolation structures

Method for forming variable width isolation structures

Patents Applicationslast 30 patents

INTEGRATED SOI PRESSURE SENSOR HAVING SILICON STRESS ISOLATION MEMBER

APPARATUS AND PROCESSES FOR SILICON ON INSULATOR MEMS PRESSURE SENSORS

ELECTRONIC PH SENSOR DIE PACKAGING

MODULAR PRESSURE SENSOR

PRESSURE-SENSOR APPARATUS

SILICON PRESSURE SENSOR

Microelectromechanical device with integrated conductive shield

Isolation scheme for reducing film stress in a MEMS device

Method and structure of ion implanted elements for the optimization...

Microelectromechanical device with integrated conductive shield