Curtis MILLER

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Beaverton, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Ball-bump bonded ribbon-wire interconnect
- Patent number 7,977,804
- Issue date Jul 12, 2011
- Tektronix, Inc.
- Dale E. Christensen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BALL-BUMP BONDED RIBBON-WIRE INTERCONNECT
- Publication number 20090283920
- Publication date Nov 19, 2009
- Tektronix, Inc.
- Dale E. Christensen
- H01 - BASIC ELECTRIC ELEMENTS