Curtis W. WARD

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Contact over active gate structures with metal oxide layers to inhi...
- Patent number 12,080,639
- Issue date Sep 3, 2024
- Intel Corporation
- Rami Hourani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin cut and fin trim isolation for advanced integrated circuit stru...
- Patent number 12,016,170
- Issue date Jun 18, 2024
- Intel Corporation
- Tahir Ghani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
1D vertical edge blocking (VEB) via and plug
- Patent number 11,972,979
- Issue date Apr 30, 2024
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin patterning for advanced integrated circuit structure fabrication
- Patent number 11,881,520
- Issue date Jan 23, 2024
- Intel Corporation
- Curtis Ward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced lithography and self-assembled devices
- Patent number 11,854,787
- Issue date Dec 26, 2023
- Intel Corporation
- Richard E. Schenker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
1D vertical edge blocking (VEB) via and plug
- Patent number 11,721,580
- Issue date Aug 8, 2023
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin cut and fin trim isolation for advanced integrated circuit stru...
- Patent number 11,646,359
- Issue date May 9, 2023
- Intel Corporation
- Tahir Ghani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench isolation for advanced integrated circuit structure fabrication
- Patent number 11,640,985
- Issue date May 2, 2023
- Intel Corporation
- Michael L. Hattendorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced lithography and self-assembled devices
- Patent number 11,373,950
- Issue date Jun 28, 2022
- Intel Corporation
- Richard E. Schenker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive via and metal line end fabrication and structures result...
- Patent number 11,145,541
- Issue date Oct 12, 2021
- Intel Corporation
- Charles H. Wallace
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin cut and fin trim isolation for advanced integrated circuit stru...
- Patent number 11,063,133
- Issue date Jul 13, 2021
- Intel Corporation
- Tahir Ghani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench isolation for advanced integrated circuit structure fabrication
- Patent number 10,930,753
- Issue date Feb 23, 2021
- Intel Corporation
- Michael L. Hattendorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced lithography and self-assembled devices
- Patent number 10,892,223
- Issue date Jan 12, 2021
- Intel Corporation
- Richard E. Schenker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin cut and fin trim isolation for advanced integrated circuit stru...
- Patent number 10,777,656
- Issue date Sep 15, 2020
- Intel Corporation
- Tahir Ghani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin cut and fin trim isolation for advanced integrated circuit stru...
- Patent number 10,460,993
- Issue date Oct 29, 2019
- Intel Corporation
- Tahir Ghani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration methods to fabricate internal spacers for nanowire devices
- Patent number 9,893,167
- Issue date Feb 13, 2018
- Intel Corporation
- Seiyon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FIN CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRU...
- Publication number 20240276698
- Publication date Aug 15, 2024
- Intel Corporation
- Tahir GHANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES
- Publication number 20240071917
- Publication date Feb 29, 2024
- Intel Corporation
- Richard E. SCHENKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
1D VERTICAL EDGE BLOCKING (VEB) VIA AND PLUG
- Publication number 20230326794
- Publication date Oct 12, 2023
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRU...
- Publication number 20230232605
- Publication date Jul 20, 2023
- Intel Corporation
- Tahir GHANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
- Publication number 20230207664
- Publication date Jun 29, 2023
- Intel Corporation
- Michael L. HATTENDORF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN PATTERNING FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
- Publication number 20230126174
- Publication date Apr 27, 2023
- Intel Corporation
- Curtis WARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES
- Publication number 20220262722
- Publication date Aug 18, 2022
- Intel Corporation
- Richard E. SCHENKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRU...
- Publication number 20210249523
- Publication date Aug 12, 2021
- Intel Corporation
- Tahir GHANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
- Publication number 20210143051
- Publication date May 13, 2021
- Intel Corporation
- Michael L. HATTENDORF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE LAYERS TO INHI...
- Publication number 20210090990
- Publication date Mar 25, 2021
- Intel Corporation
- Rami HOURANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES
- Publication number 20210082800
- Publication date Mar 18, 2021
- Intel Corporation
- Richard E. SCHENKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
1D VERTICAL EDGE BLOCKING (VEB) VIA AND PLUG
- Publication number 20200388534
- Publication date Dec 10, 2020
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRU...
- Publication number 20200343366
- Publication date Oct 29, 2020
- Intel Corporation
- Tahir GHANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN PATTERNING FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
- Publication number 20200227413
- Publication date Jul 16, 2020
- Intel Corporation
- Curtis WARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE VIA AND METAL LINE END FABRICATION AND STRUCTURES RESULT...
- Publication number 20200185271
- Publication date Jun 11, 2020
- Intel Corporation
- Charles H. WALLACE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES
- Publication number 20200066629
- Publication date Feb 27, 2020
- Intel Corporation
- Richard E. SCHENKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRU...
- Publication number 20200013876
- Publication date Jan 9, 2020
- Intel Corporation
- Tahir GHANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
- Publication number 20190164808
- Publication date May 30, 2019
- Intel Corporation
- Michael L. HATTENDORF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRU...
- Publication number 20190164836
- Publication date May 30, 2019
- Intel Corporation
- Tahir GHANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION METHODS TO FABRICATE INTERNAL SPACERS FOR NANOWIRE DEVICES
- Publication number 20170053998
- Publication date Feb 23, 2017
- Intel Corporation
- Seiyon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photoresist process to enable sloped passivation bondpad openings f...
- Publication number 20050263899
- Publication date Dec 1, 2005
- Swaminathan Sivakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photoresist process to enable sloped passivation bondpad openings f...
- Publication number 20050148180
- Publication date Jul 7, 2005
- Swaminathan Sivakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pattern transfer of an extreme ultraviolet imaging layer via flood...
- Publication number 20040265748
- Publication date Dec 30, 2004
- Robert Bristol
- H01 - BASIC ELECTRIC ELEMENTS

Curtis W. WARD

Person

Patents Grantslast 30 patents

Contact over active gate structures with metal oxide layers to inhi...

Fin cut and fin trim isolation for advanced integrated circuit stru...

1D vertical edge blocking (VEB) via and plug

Fin patterning for advanced integrated circuit structure fabrication

Advanced lithography and self-assembled devices

1D vertical edge blocking (VEB) via and plug

Fin cut and fin trim isolation for advanced integrated circuit stru...

Trench isolation for advanced integrated circuit structure fabrication

Advanced lithography and self-assembled devices

Conductive via and metal line end fabrication and structures result...

Fin cut and fin trim isolation for advanced integrated circuit stru...

Trench isolation for advanced integrated circuit structure fabrication

Advanced lithography and self-assembled devices

Fin cut and fin trim isolation for advanced integrated circuit stru...

Fin cut and fin trim isolation for advanced integrated circuit stru...

Integration methods to fabricate internal spacers for nanowire devices

Patents Applicationslast 30 patents

FIN CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRU...

ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES

1D VERTICAL EDGE BLOCKING (VEB) VIA AND PLUG

FIN CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRU...

TRENCH ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION

FIN PATTERNING FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION

ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES

FIN CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRU...

TRENCH ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION

CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE LAYERS TO INHI...

ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES

1D VERTICAL EDGE BLOCKING (VEB) VIA AND PLUG

FIN CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRU...

FIN PATTERNING FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION

CONDUCTIVE VIA AND METAL LINE END FABRICATION AND STRUCTURES RESULT...

ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES

FIN CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRU...

TRENCH ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION

FIN CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRU...

INTEGRATION METHODS TO FABRICATE INTERNAL SPACERS FOR NANOWIRE DEVICES

Photoresist process to enable sloped passivation bondpad openings f...

Photoresist process to enable sloped passivation bondpad openings f...

Pattern transfer of an extreme ultraviolet imaging layer via flood...