Cyriac Devasia

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Nashua, NH, US

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Patents Grantslast 30 patents

Information Patent Grant
Die bonding system with heated automatic collet changer
- Patent number 12,237,202
- Issue date Feb 25, 2025
- MRSI Systems, LLC
- Nicholas Samuel Celia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding system with wafer lift and level assembly
- Patent number 11,791,197
- Issue date Oct 17, 2023
- MRSI Systems LLC
- Nicholas Samuel Celia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermo-compression bonding system, subsystems, and methods of use
- Patent number 9,911,710
- Issue date Mar 6, 2018
- MRSI Systems, LLC
- Nicholas Samuel Celia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for chip placement
- Patent number 6,389,688
- Issue date May 21, 2002
- Micro Robotics Systems, Inc.
- Nilendu Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dispensing apparatus
- Patent number 6,220,487
- Issue date Apr 24, 2001
- Micro Robotics Systems, Inc.
- Nilendu Srivastava
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...

Patents Applicationslast 30 patents

Information Patent Application
DIE BONDING SYSTEM WITH WAFER LIFT AND LEVEL ASSEMBLY
- Publication number 20230148356
- Publication date May 11, 2023
- MRSI Systems LLC
- Nicholas Samuel Celia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING SYSTEM WITH HEATED AUTOMATIC COLLET CHANGER
- Publication number 20220102187
- Publication date Mar 31, 2022
- MRSI Systems LLC
- Nicholas Samuel Celia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMO-COMPRESSION BONDING SYSTEM, SUBSYSTEMS, AND METHODS OF USE
- Publication number 20160126213
- Publication date May 5, 2016
- MRSI SYSTEMS LLC
- Nicholas Samuel Celia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR THERMO-COMPRESSION BONDING OF HIGH BUMP COUNT...
- Publication number 20150380379
- Publication date Dec 31, 2015
- MRSI Systems, LLC
- Cyriac Devasia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for dispensing precise amounts of a non-compressible fluid
- Publication number 20050072815
- Publication date Apr 7, 2005
- Dennis Carew
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Flip chip device assembly machine
- Publication number 20050045914
- Publication date Mar 3, 2005
- Newport Corporation
- Edward Agranat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR