Cyril Buttay

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Sheffield, GB

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Patents Grantslast 30 patents

Information Patent Grant
Power electronic package having two substrates with multiple semico...
- Patent number 8,432,030
- Issue date Apr 30, 2013
- Denso Corporation
- Rajesh Kumar Malhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic package having two substrates with multiple semico...
- Patent number 7,999,369
- Issue date Aug 16, 2011
- Denso Corporation
- Rajesh Kumar Malhan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER ELECTRONIC PACKAGE HAVING TWO SUBSTRATES WITH MULTIPLE SEMICO...
- Publication number 20110254177
- Publication date Oct 20, 2011
- DENSO CORPORATION
- Rajesh Kumar Malhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power electronic package having two substrates with multiple semico...
- Publication number 20080054439
- Publication date Mar 6, 2008
- DENSO CORPORATION
- Rajesh Kumar Malhan
- H01 - BASIC ELECTRIC ELEMENTS