Da CHEN

Person

Ningbo, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Image capturing assembly, lens module and electronic device
- Patent number 11,430,825
- Issue date Aug 30, 2022
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image capturing assembly and packaging method thereof, lens module,...
- Patent number 11,296,141
- Issue date Apr 5, 2022
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera assembly and packaging method thereof, lens module, electron...
- Patent number 11,171,166
- Issue date Nov 9, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera assembly and packaging method thereof, lens module, and elec...
- Patent number 11,069,670
- Issue date Jul 20, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera assembly and packaging methods thereof, lens module, and ele...
- Patent number 10,887,499
- Issue date Jan 5, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive assembly and formation methods thereof, lens module,...
- Patent number 10,886,315
- Issue date Jan 5, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image capturing assembly and packaging method thereof, lens module...
- Patent number 10,861,895
- Issue date Dec 8, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAMERA ASSEMBLY, LENS MODULE, AND ELECTRONIC DEVICE
- Publication number 20220045112
- Publication date Feb 10, 2022
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA ASSEMBLY, LENS MODULE, AND ELECTRONIC DEVICE
- Publication number 20210320095
- Publication date Oct 14, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE CAPTURING ASSEMBLY, LENS MODULE AND ELECTRONIC DEVICE
- Publication number 20210066381
- Publication date Mar 4, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE CAPTURING ASSEMBLY AND PACKAGING METHOD THEREOF, LENS MODULE,...
- Publication number 20200161346
- Publication date May 21, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA ASSEMBLY AND PACKAGING METHOD THEREOF, LENS MODULE, AND ELEC...
- Publication number 20200161289
- Publication date May 21, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA ASSEMBLY AND PACKAGING METHODS THEREOF, LENS MODULE, AND ELE...
- Publication number 20200162645
- Publication date May 21, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAMERA ASSEMBLY AND PACKAGING METHOD THEREOF, LENS MODULE, ELECTRON...
- Publication number 20200161350
- Publication date May 21, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE CAPTURING ASSEMBLY AND PACKAGING METHOD THEREOF, LENS MODULE...
- Publication number 20200161359
- Publication date May 21, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA ASSEMBLY AND PACKAGING METHOD, LENS MODULE AND ELECTRONIC DE...
- Publication number 20200161356
- Publication date May 21, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da CHEN
- G02 - OPTICS
Information Patent Application
PHOTOSENSITIVE ASSEMBLY AND FORMATION METHODS THEREOF, LENS MODULE,...
- Publication number 20200135782
- Publication date Apr 30, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Image capturing assembly, lens module and electronic device

Image capturing assembly and packaging method thereof, lens module,...

Camera assembly and packaging method thereof, lens module, electron...

Camera assembly and packaging method thereof, lens module, and elec...

Camera assembly and packaging methods thereof, lens module, and ele...

Photosensitive assembly and formation methods thereof, lens module,...

Image capturing assembly and packaging method thereof, lens module...

Patents Applicationslast 30 patents

CAMERA ASSEMBLY, LENS MODULE, AND ELECTRONIC DEVICE

CAMERA ASSEMBLY, LENS MODULE, AND ELECTRONIC DEVICE

IMAGE CAPTURING ASSEMBLY, LENS MODULE AND ELECTRONIC DEVICE

IMAGE CAPTURING ASSEMBLY AND PACKAGING METHOD THEREOF, LENS MODULE,...

CAMERA ASSEMBLY AND PACKAGING METHOD THEREOF, LENS MODULE, AND ELEC...

CAMERA ASSEMBLY AND PACKAGING METHODS THEREOF, LENS MODULE, AND ELE...

CAMERA ASSEMBLY AND PACKAGING METHOD THEREOF, LENS MODULE, ELECTRON...

IMAGE CAPTURING ASSEMBLY AND PACKAGING METHOD THEREOF, LENS MODULE...

CAMERA ASSEMBLY AND PACKAGING METHOD, LENS MODULE AND ELECTRONIC DE...

PHOTOSENSITIVE ASSEMBLY AND FORMATION METHODS THEREOF, LENS MODULE,...