Da-Yuan Shih

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 11,257,767
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 10,340,226
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal post bonding using pre-fabricated metal posts
- Patent number 10,034,390
- Issue date Jul 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump stretching method for forming a solder bump joint in a...
- Patent number 9,978,709
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of multi-chip wafer level packaging
- Patent number 9,679,882
- Issue date Jun 13, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-step direct bonding processes and tools for performing the same
- Patent number 9,521,795
- Issue date Dec 13, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump joint in a device including lamellar structures
- Patent number 9,475,145
- Issue date Oct 25, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a plurality of metal posts
- Patent number 9,263,407
- Issue date Feb 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 9,230,932
- Issue date Jan 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Indirect printing bumping method for solder ball deposition
- Patent number 9,216,469
- Issue date Dec 22, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Li Hsiao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joint structure for substrates and methods of forming
- Patent number 9,082,763
- Issue date Jul 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Looped interconnect structure
- Patent number 8,927,877
- Issue date Jan 6, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-An Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional chip stack and method of forming the same
- Patent number 8,803,333
- Issue date Aug 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip wafer level package
- Patent number 8,754,514
- Issue date Jun 17, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Hui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming through vias
- Patent number 8,685,798
- Issue date Apr 1, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus and methods for forming through vias
- Patent number 8,476,770
- Issue date Jul 2, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Interconnect Crack Arrestor Structure and Methods
- Publication number 20190326228
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP STRETCHING METHOD FOR FORMING A SOLDER BUMP JOINT IN A...
- Publication number 20170012019
- Publication date Jan 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun YANG
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Method of Multi-Chip Wafer Level Packaging
- Publication number 20160155731
- Publication date Jun 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Post Bonding Using Pre-Fabricated Metal Posts
- Publication number 20160143157
- Publication date May 19, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnect Crack Arrestor Structure and Methods
- Publication number 20160118351
- Publication date Apr 28, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDIRECT PRINTING BUMPING METHOD FOR SOLDER BALL DEPOSITION
- Publication number 20150108206
- Publication date Apr 23, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Li Hsiao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal Post Bonding Using Pre-Fabricated Metal Posts
- Publication number 20140262470
- Publication date Sep 18, 2014
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Two-Step Direct Bonding Processes and Tools for Performing the Same
- Publication number 20140263583
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Looped Interconnect Structure
- Publication number 20140041918
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-An Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME
- Publication number 20130307144
- Publication date Nov 21, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming Through Vias
- Publication number 20130273698
- Publication date Oct 17, 2013
- Tung-Liang Shao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Joint Structure for Substrates and Methods of Forming
- Publication number 20130241083
- Publication date Sep 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP STRETCHING METHOD FOR FORMING A SOLDER BUMP JOINT IN A...
- Publication number 20130221521
- Publication date Aug 29, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BUMP STRETCHING METHOD
- Publication number 20130221074
- Publication date Aug 29, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chang WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Crack Arrestor Structure and Methods
- Publication number 20130207239
- Publication date Aug 15, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Multi-Chip Wafer Level Packaging
- Publication number 20130040423
- Publication date Feb 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Wafer Level Package
- Publication number 20130037950
- Publication date Feb 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Hui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Methods for Forming Through Vias
- Publication number 20130009319
- Publication date Jan 10, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
COOLING MECHANISM FOR STACKED DIE PACKAGE AND METHOD OF MANUFACTURI...
- Publication number 20120061059
- Publication date Mar 15, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li HSIAO
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING MECHANISM FOR STACKED DIE PACKAGE AND METHOD OF MANUFACTURI...
- Publication number 20120063090
- Publication date Mar 15, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li HSIAO
- H01 - BASIC ELECTRIC ELEMENTS

Da-Yuan Shih

Person

Patents Grantslast 30 patents

Interconnect crack arrestor structure and methods

Interconnect crack arrestor structure and methods

Metal post bonding using pre-fabricated metal posts

Solder bump stretching method for forming a solder bump joint in a...

Method of multi-chip wafer level packaging

Two-step direct bonding processes and tools for performing the same

Solder bump joint in a device including lamellar structures

Method for manufacturing a plurality of metal posts

Interconnect crack arrestor structure and methods

Indirect printing bumping method for solder ball deposition

Joint structure for substrates and methods of forming

Looped interconnect structure

Three-dimensional chip stack and method of forming the same

Multi-chip wafer level package

Methods for forming through vias

Apparatus and methods for forming through vias

Patents Applicationslast 30 patents

Interconnect Crack Arrestor Structure and Methods

SOLDER BUMP STRETCHING METHOD FOR FORMING A SOLDER BUMP JOINT IN A...

Method of Multi-Chip Wafer Level Packaging

Metal Post Bonding Using Pre-Fabricated Metal Posts

Interconnect Crack Arrestor Structure and Methods

INDIRECT PRINTING BUMPING METHOD FOR SOLDER BALL DEPOSITION

Metal Post Bonding Using Pre-Fabricated Metal Posts

Two-Step Direct Bonding Processes and Tools for Performing the Same

Looped Interconnect Structure

THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME

Methods for Forming Through Vias

Joint Structure for Substrates and Methods of Forming

SOLDER BUMP STRETCHING METHOD FOR FORMING A SOLDER BUMP JOINT IN A...

SOLDER BUMP STRETCHING METHOD

Interconnect Crack Arrestor Structure and Methods

Method of Multi-Chip Wafer Level Packaging

Multi-Chip Wafer Level Package

Apparatus and Methods for Forming Through Vias

COOLING MECHANISM FOR STACKED DIE PACKAGE AND METHOD OF MANUFACTURI...

COOLING MECHANISM FOR STACKED DIE PACKAGE AND METHOD OF MANUFACTURI...