Da Yuan Shih

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ultrasonic-assisted solder transfer
- Patent number 11,541,472
- Issue date Jan 3, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combination polyimide decal with a rigid mold
- Patent number 11,270,966
- Issue date Mar 8, 2022
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Continuous solder transfer to substrates
- Patent number 11,110,534
- Issue date Sep 7, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Injection molded microoptics
- Patent number 10,833,120
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Lawrence Jacobowitz
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Injection molded microoptics
- Patent number 10,490,594
- Issue date Nov 26, 2019
- International Business Machines Corporation
- Lawrence Jacobwitz
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Reduced volume interconnect for three-dimensional chip stack
- Patent number 9,679,875
- Issue date Jun 13, 2017
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced volume interconnect for three-dimensional chip stack
- Patent number 9,543,273
- Issue date Jan 10, 2017
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molded microoptics
- Patent number 9,490,408
- Issue date Nov 8, 2016
- International Business Machines Corporation
- Lawrence Jacobowitz
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Coaxial probe structure of elongated electrical conductors projecti...
- Patent number 9,404,942
- Issue date Aug 2, 2016
- GLOBALFOUNDRIES Inc.
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
No flow underfill or wafer level underfill and solder columns
- Patent number 9,343,423
- Issue date May 17, 2016
- International Business Machines Corporation
- Claudius Ferger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No flow underfill or wafer level underfill and solder columns
- Patent number 9,305,896
- Issue date Apr 5, 2016
- International Business Machines Corporation
- Claudius Ferger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper post solder bumps on substrates
- Patent number 9,252,120
- Issue date Feb 2, 2016
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration-resistant under-bump metallization of nickel-iron...
- Patent number 9,082,762
- Issue date Jul 14, 2015
- International Business Machines Corporation
- Sung K. Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper post solder bumps on substrates
- Patent number 9,012,266
- Issue date Apr 21, 2015
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No flow underfill or wafer level underfill and solder columns
- Patent number 8,963,340
- Issue date Feb 24, 2015
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper post solder bumps on substrates
- Patent number 8,945,995
- Issue date Feb 3, 2015
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper post solder bumps on substrates
- Patent number 8,877,556
- Issue date Nov 4, 2014
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe structure having a plurality of discrete insulated probe tips...
- Patent number 8,754,666
- Issue date Jun 17, 2014
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Microcavity structure and process
- Patent number 8,703,274
- Issue date Apr 22, 2014
- International Business Machines Corporation
- Russell A. Budd
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prevention and control of intermetallic alloy inclusions that form...
- Patent number 8,691,685
- Issue date Apr 8, 2014
- International Business Machines Corporation
- Sung Kwon Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prevention and control of intermetallic alloy inclusions
- Patent number 8,679,964
- Issue date Mar 25, 2014
- International Business Machines Corporation
- Sung Kwon Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper post solder bumps on substrate
- Patent number 8,669,137
- Issue date Mar 11, 2014
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect forming method
- Patent number 8,541,299
- Issue date Sep 24, 2013
- Ultratech, Inc.
- Stephen Leslie Buchwalter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redox method of forming a coaxial probe structure of elongated elec...
- Patent number 8,491,772
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Electrodeposition method of forming a probe structure having a plur...
- Patent number 8,486,250
- Issue date Jul 16, 2013
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Electrical interconnect structure
- Patent number 8,476,773
- Issue date Jul 2, 2013
- International Business Machines Corporation
- Stephen Leslie Buchwalter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnections for flip-chip using lead-free solders and having i...
- Patent number 8,314,500
- Issue date Nov 20, 2012
- Ultratech, Inc.
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sprocket opening alignment process and apparatus for multilayer sol...
- Patent number 8,268,719
- Issue date Sep 18, 2012
- International Business Machines Corporation
- Stephen L. Buchwalter
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electrical interconnect forming method
- Patent number 8,242,010
- Issue date Aug 14, 2012
- International Business Machines Corporation
- Stephen Leslie Buchwalter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned metal thermal interface
- Patent number 8,156,998
- Issue date Apr 17, 2012
- International Business Machines Corporation
- Bruce K. Furman
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
ULTRASONIC-ASSISTED SOLDER TRANSFER
- Publication number 20210229203
- Publication date Jul 29, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINATION POLYIMIDE DECAL WITH A RIGID MOLD
- Publication number 20210151402
- Publication date May 20, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTINUOUS SOLDER TRANSFER TO SUBSTRATES
- Publication number 20200316702
- Publication date Oct 8, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INJECTION MOLDED MICROOPTICS
- Publication number 20200020738
- Publication date Jan 16, 2020
- International Business Machines Corporation
- Lawrence Jacobowitz
- B82 - NANO-TECHNOLOGY
Information Patent Application
INJECTION MOLDED MICROOPTICS
- Publication number 20170033153
- Publication date Feb 2, 2017
- International Business Machines Corporation
- Lawrence Jacobowitz
- G02 - OPTICS
Information Patent Application
REDUCED VOLUME INTERCONNECT FOR THREE-DIMENSIONAL CHIP STACK
- Publication number 20160240501
- Publication date Aug 18, 2016
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED VOLUME INTERCONNECT FOR THREE-DIMENSIONAL CHIP STACK
- Publication number 20160211242
- Publication date Jul 21, 2016
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO FLOW UNDERFILL OR WAFER LEVEL UNDERFILL AND SOLDER COLUMNS
- Publication number 20150147851
- Publication date May 28, 2015
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO FLOW UNDERFILL OR WAFER LEVEL UNDERFILL AND SOLDER COLUMNS
- Publication number 20150147846
- Publication date May 28, 2015
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER POST SOLDER BUMPS ON SUBSTRATES
- Publication number 20150031173
- Publication date Jan 29, 2015
- International Bushiness Machines Corporation
- Jae-Woong NAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Post Solder Bumps on Substrates
- Publication number 20140370662
- Publication date Dec 18, 2014
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDOX METHOD OF FORMING A COAXIAL PROBE STRUCTURE OF ELONGATED ELEC...
- Publication number 20140191775
- Publication date Jul 10, 2014
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
Copper Post Solder Bumps on Substrates
- Publication number 20140170816
- Publication date Jun 19, 2014
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INJECTION MOLDED MICROOPTICS
- Publication number 20140084314
- Publication date Mar 27, 2014
- International Business Machines Corporation
- Lawrence Jacobowitz
- B82 - NANO-TECHNOLOGY
Information Patent Application
Copper Post Solder Bumps on Substrates
- Publication number 20140057392
- Publication date Feb 27, 2014
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
No Flow Underfill or Wafer Level Underfill and Solder Columns
- Publication number 20130062757
- Publication date Mar 14, 2013
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Post Solder Bumps on Substrate
- Publication number 20120252168
- Publication date Oct 4, 2012
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL V...
- Publication number 20120205425
- Publication date Aug 16, 2012
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL V...
- Publication number 20120201596
- Publication date Aug 9, 2012
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...
- Publication number 20120012642
- Publication date Jan 19, 2012
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LIQUID METAL-SOLDER THERMAL INTERFACE
- Publication number 20110240279
- Publication date Oct 6, 2011
- International Business Machines Corporation
- BRUCE K. Furman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMIGRATION-RESISTANT UNDER-BUMP METALLIZATION OF NICKEL-IRON...
- Publication number 20110156256
- Publication date Jun 30, 2011
- International Business Machines Corporation
- Sung K. Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sprocket Opening Alignment Process and Apparatus for Multilayer Sol...
- Publication number 20110097892
- Publication date Apr 28, 2011
- International Business Machines Corporation
- Stephen L. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT FORMING METHOD
- Publication number 20100230475
- Publication date Sep 16, 2010
- International Business Machines Corporation
- Stephen Leslie Buchwalter
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRICAL INTERCONNECT STRUCTURE
- Publication number 20100230143
- Publication date Sep 16, 2010
- International Business Machines Corporation
- Stephen Leslie Buchwalter
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRICAL INTERCONNECT FORMING METHOD
- Publication number 20100230474
- Publication date Sep 16, 2010
- International Business Machines Corporation
- Stephen Leslie Buchwalter
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
NOVEL STRUCTURE OF UBM AND SOLDER BUMPS AND METHODS OF FABRICATION
- Publication number 20100193949
- Publication date Aug 5, 2010
- International Business Machines Corporation
- Luc L. Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RIC...
- Publication number 20100155456
- Publication date Jun 24, 2010
- International Business Machines Corp.
- GARETH G. HOUGHAM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNED METAL THERMAL INTERFACE
- Publication number 20100147497
- Publication date Jun 17, 2010
- Bruce K. Furman
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING APPARATUS WITH COLD PLATE FORMED IN SITU ON A SURFACE TO BE...
- Publication number 20100142150
- Publication date Jun 10, 2010
- International Business Machines Corporation
- Levi A. CAMPBELL
- H01 - BASIC ELECTRIC ELEMENTS

Da Yuan Shih

Person

Patents Grantslast 30 patents

Ultrasonic-assisted solder transfer

Combination polyimide decal with a rigid mold

Continuous solder transfer to substrates

Injection molded microoptics

Injection molded microoptics

Reduced volume interconnect for three-dimensional chip stack

Reduced volume interconnect for three-dimensional chip stack

Injection molded microoptics

Coaxial probe structure of elongated electrical conductors projecti...

No flow underfill or wafer level underfill and solder columns

No flow underfill or wafer level underfill and solder columns

Copper post solder bumps on substrates

Electromigration-resistant under-bump metallization of nickel-iron...

Copper post solder bumps on substrates

No flow underfill or wafer level underfill and solder columns

Copper post solder bumps on substrates

Copper post solder bumps on substrates

Probe structure having a plurality of discrete insulated probe tips...

Microcavity structure and process

Prevention and control of intermetallic alloy inclusions that form...

Prevention and control of intermetallic alloy inclusions

Copper post solder bumps on substrate

Electrical interconnect forming method

Redox method of forming a coaxial probe structure of elongated elec...

Electrodeposition method of forming a probe structure having a plur...

Electrical interconnect structure

Interconnections for flip-chip using lead-free solders and having i...

Sprocket opening alignment process and apparatus for multilayer sol...

Electrical interconnect forming method

Patterned metal thermal interface

Patents Applicationslast 30 patents

ULTRASONIC-ASSISTED SOLDER TRANSFER

COMBINATION POLYIMIDE DECAL WITH A RIGID MOLD

CONTINUOUS SOLDER TRANSFER TO SUBSTRATES

INJECTION MOLDED MICROOPTICS

INJECTION MOLDED MICROOPTICS

REDUCED VOLUME INTERCONNECT FOR THREE-DIMENSIONAL CHIP STACK

REDUCED VOLUME INTERCONNECT FOR THREE-DIMENSIONAL CHIP STACK

NO FLOW UNDERFILL OR WAFER LEVEL UNDERFILL AND SOLDER COLUMNS

NO FLOW UNDERFILL OR WAFER LEVEL UNDERFILL AND SOLDER COLUMNS

COPPER POST SOLDER BUMPS ON SUBSTRATES

Copper Post Solder Bumps on Substrates

REDOX METHOD OF FORMING A COAXIAL PROBE STRUCTURE OF ELONGATED ELEC...

Copper Post Solder Bumps on Substrates

INJECTION MOLDED MICROOPTICS

Copper Post Solder Bumps on Substrates

No Flow Underfill or Wafer Level Underfill and Solder Columns

Copper Post Solder Bumps on Substrate

MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL V...

MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL V...

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...

HYBRID LIQUID METAL-SOLDER THERMAL INTERFACE

ELECTROMIGRATION-RESISTANT UNDER-BUMP METALLIZATION OF NICKEL-IRON...

Sprocket Opening Alignment Process and Apparatus for Multilayer Sol...

ELECTRICAL INTERCONNECT FORMING METHOD

ELECTRICAL INTERCONNECT STRUCTURE

ELECTRICAL INTERCONNECT FORMING METHOD

NOVEL STRUCTURE OF UBM AND SOLDER BUMPS AND METHODS OF FABRICATION

METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RIC...

PATTERNED METAL THERMAL INTERFACE

COOLING APPARATUS WITH COLD PLATE FORMED IN SITU ON A SURFACE TO BE...