Dae-hyun RYU

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Seongnam-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Interleaving and puncturing apparatus and method thereof
- Patent number 10,461,778
- Issue date Oct 29, 2019
- Samsung Electronics Co., Ltd.
- Hong-sil Jeong
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Encoding apparatus and encoding method thereof
- Patent number 9,660,669
- Issue date May 23, 2017
- Samsung Electronics Co., Ltd.
- Hong-sil Jeong
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Interleaving and puncturing apparatus and method thereof
- Patent number 9,641,198
- Issue date May 2, 2017
- Samsung Electronics Co., Ltd.
- Hong-sil Jeong
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
INTERLEAVING AND PUNCTURING APPARATUS AND METHOD THEREOF
- Publication number 20150333769
- Publication date Nov 19, 2015
- Samsung Electronics Co., Ltd.
- Hong-sil JEONG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ENCODING APPARATUS AND ENCODING METHOD THEREOF
- Publication number 20150333767
- Publication date Nov 19, 2015
- Samsung Electronics Co., Ltd.
- Hong-sil JEONG
- H03 - BASIC ELECTRONIC CIRCUITRY