Membership
Tour
Register
Log in
Dae-Sup HYUN
Follow
Person
Midland, MI, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Silicone composition for temporary bonding adhesive, electronic art...
Patent number
11,512,236
Issue date
Nov 29, 2022
Dae-Sup Hyun
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
SILICONE COMPOSITION FOR TEMPORARY BONDING ADHESIVE, ELECTRONIC ART...
Publication number
20200255710
Publication date
Aug 13, 2020
Dow Silicones Corporation
Dae-Sup HYUN
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...