Dae-Woo Son

Person

Cheonan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 9,129,972
- Issue date Sep 8, 2015
- Samsung Electronics Co., Ltd.
- Young-sang Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and film and tab package comprising the chip and...
- Patent number 8,952,510
- Issue date Feb 10, 2015
- Samsung Electronics Co., Ltd.
- Young-Sang Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and film and TAB package comprising the chip and...
- Patent number 8,575,735
- Issue date Nov 5, 2013
- Samsung Electronics Co., Ltd.
- Young-Sang Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape for heat dissipating member, chip on film type semiconductor p...
- Patent number 8,222,089
- Issue date Jul 17, 2012
- Samsung Electronics Co., Ltd.
- Kyoung-sei Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape for heat dissipating member, chip on film type semiconductor p...
- Patent number 7,915,727
- Issue date Mar 29, 2011
- Samsung Electronics Co., Ltd.
- Kyoung-sei Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape circuit substrate and semiconductor apparatus employing the same
- Patent number 7,339,262
- Issue date Mar 4, 2008
- Samsung Electronics Co., Ltd.
- Dae-Woo Son
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape circuit substrate having wavy beam leads and semiconductor chi...
- Patent number 7,247,936
- Issue date Jul 24, 2007
- Samsung Electronics Co., Ltd.
- Dae-Woo Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for bonding a flexible printed circuit cable t...
- Patent number 6,902,261
- Issue date Jun 7, 2005
- Samsung Electronics Co., Ltd.
- Jeong-seon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape circuit board and semiconductor chip package including the same
- Patent number 6,818,542
- Issue date Nov 16, 2004
- Samsung Electronics Co., Ltd.
- Dae-Woo Son
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape circuit board and semiconductor chip package including the same
- Patent number 6,737,590
- Issue date May 18, 2004
- Samsung Electronics Co., Ltd.
- Dae-Woo Son
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for packaging integrated circuits with elastomer chip carriers
- Patent number 6,103,554
- Issue date Aug 15, 2000
- Samsung Electronics, Co., Ltd.
- Dae Woo Son
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP AND FILM AND TAB PACKAGE COMPRISING THE CHIP AND...
- Publication number 20140084430
- Publication date Mar 27, 2014
- Samsung Electronics Co., Ltd.
- Young-Sang Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING FILM CIRCUIT SUBSTRATE AND METHOD OF FABRICAT...
- Publication number 20120021600
- Publication date Jan 26, 2012
- Samsung Electronics Co., Ltd.
- Sang-Uk Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND FILM AND TAB PACKAGE COMPRISING THE CHIP AND...
- Publication number 20110210433
- Publication date Sep 1, 2011
- Young-Sang Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE FOR HEAT DISSIPATING MEMBER, CHIP ON FILM TYPE SEMICONDUCTOR P...
- Publication number 20110143625
- Publication date Jun 16, 2011
- Kyoung-sei Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package
- Publication number 20100001392
- Publication date Jan 7, 2010
- SAMSUNG ELECTRONICS CO., LTD.
- Young-sang Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tape for heat dissipating member, chip on film type semiconductor p...
- Publication number 20090273076
- Publication date Nov 5, 2009
- Kyong-sei CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tape circuit substrate and semiconductor apparatus employing the same
- Publication number 20050093114
- Publication date May 5, 2005
- Dae-Woo Son
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tape circuit substrate having wavy beam leads and semiconductor chi...
- Publication number 20040178501
- Publication date Sep 16, 2004
- Dae-Woo Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tape circuit board and semiconductor chip package including the same
- Publication number 20040175915
- Publication date Sep 9, 2004
- Samsung Electronics Co., Ltd.
- Dae-Woo Son
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for bonding a flexible printed circuit cable t...
- Publication number 20030214558
- Publication date Nov 20, 2003
- Samsung Electronics Co. Ltd.
- Jeong-Seon Kim
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Tape circuit board and semiconductor chip package including the same
- Publication number 20020104684
- Publication date Aug 8, 2002
- Samsung Electronics Co., Ltd.
- Dae-Woo Son
- H01 - BASIC ELECTRIC ELEMENTS

Dae-Woo Son

Person

Patents Grantslast 30 patents

Semiconductor package

Semiconductor chip and film and tab package comprising the chip and...

Semiconductor chip and film and TAB package comprising the chip and...

Tape for heat dissipating member, chip on film type semiconductor p...

Tape for heat dissipating member, chip on film type semiconductor p...

Tape circuit substrate and semiconductor apparatus employing the same

Tape circuit substrate having wavy beam leads and semiconductor chi...

Method and apparatus for bonding a flexible printed circuit cable t...

Tape circuit board and semiconductor chip package including the same

Tape circuit board and semiconductor chip package including the same

Method for packaging integrated circuits with elastomer chip carriers

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP AND FILM AND TAB PACKAGE COMPRISING THE CHIP AND...

METHOD OF FABRICATING FILM CIRCUIT SUBSTRATE AND METHOD OF FABRICAT...

SEMICONDUCTOR CHIP AND FILM AND TAB PACKAGE COMPRISING THE CHIP AND...

TAPE FOR HEAT DISSIPATING MEMBER, CHIP ON FILM TYPE SEMICONDUCTOR P...

Semiconductor package

Tape for heat dissipating member, chip on film type semiconductor p...

Tape circuit substrate and semiconductor apparatus employing the same

Tape circuit substrate having wavy beam leads and semiconductor chi...

Tape circuit board and semiconductor chip package including the same

Method and apparatus for bonding a flexible printed circuit cable t...

Tape circuit board and semiconductor chip package including the same