Dae-Wook Yang

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Pyoungtaek-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of connecting a shielding layer to...
- Patent number 7,851,893
- Issue date Dec 14, 2010
- STATS ChipPAC, Ltd.
- Seung Won Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit underfill package system
- Patent number 7,741,726
- Issue date Jun 22, 2010
- Stats Chippac Ltd.
- Hyung Jun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit underfill package system
- Patent number 7,485,502
- Issue date Feb 3, 2009
- Stats Chippac Ltd.
- Hyung Jun Jeon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Connecting a Shielding Layer to...
- Publication number 20090302437
- Publication date Dec 10, 2009
- STATS ChipPAC, Ltd.
- Seung Won Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT UNDERFILL PACKAGE SYSTEM
- Publication number 20090096112
- Publication date Apr 16, 2009
- Hyung Jun Jeon
- H01 - BASIC ELECTRIC ELEMENTS