Dae Young Jung

Person

LaGrangeville, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and structure to reduce cracking in flip chip underfill
- Patent number 7,919,356
- Issue date Apr 5, 2011
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for enhancing resistance to fracture of bondin...
- Patent number 7,867,887
- Issue date Jan 11, 2011
- International Business Machines Corporation
- Ian D. Melville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser fuse structures for high power applications
- Patent number 7,701,035
- Issue date Apr 20, 2010
- International Business Machines Corporation
- Stephen E. Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip shape alteration
- Patent number 7,648,891
- Issue date Jan 19, 2010
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for enhancing resistance to fracture of bondin...
- Patent number 7,573,115
- Issue date Aug 11, 2009
- International Business Machines Corporation
- Ian D. Melville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of inhibition of metal diffusion arising from laser dicing
- Patent number 7,566,637
- Issue date Jul 28, 2009
- International Business Machines Corporation
- Mukta G Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a crack stop void in a low-k dielectric layer bet...
- Patent number 7,479,447
- Issue date Jan 20, 2009
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unique feature design enabling structural integrity for advanced lo...
- Patent number 6,815,346
- Issue date Nov 9, 2004
- International Business Machines Corporation
- Charles R. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unique feature design enabling structural integrity for advanced lo...
- Patent number 6,650,010
- Issue date Nov 18, 2003
- International Business Machines Corporation
- Charles R. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless plating with bi-level control of dissolved oxygen, with...
- Patent number 4,967,690
- Issue date Nov 6, 1990
- International Business Machines Corporation
- Edmond O. Fey
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper deposition from electroless plating bath
- Patent number 4,904,506
- Issue date Feb 27, 1990
- International Business Machines Corporation
- Peter A. Burnett
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for preparing substrates for deposition of metal seed from a...
- Patent number 4,869,930
- Issue date Sep 26, 1989
- International Business Machines Corporation
- Thomas C. Clarke
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless plating with bi-level control of dissolved oxygen
- Patent number 4,684,545
- Issue date Aug 4, 1987
- International Business Machines Corporation
- Edmond O. Fey
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP SHAPE ALTERATION
- Publication number 20100019354
- Publication date Jan 28, 2010
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INHIBITION OF METAL DIFFUSION ARISING FROM LASER DICING
- Publication number 20090155983
- Publication date Jun 18, 2009
- International Business Machines Corporation
- MUKTA G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE TO REDUCE CRACKING IN FLIP CHIP UNDERFILL
- Publication number 20090032974
- Publication date Feb 5, 2009
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR ENHANCING RESISTANCE TO FRACTURE OF BONDIN...
- Publication number 20080274608
- Publication date Nov 6, 2008
- International Business Machines Corporation
- Ian D. Melville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP SHAPE ALTERATION
- Publication number 20080150087
- Publication date Jun 26, 2008
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR ENHANCING RESISTANCE TO FRACTURE OF BONDIN...
- Publication number 20080111250
- Publication date May 15, 2008
- International Business Machines Corporation
- Ian D. Melville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STACK STRUCTURES
- Publication number 20080029898
- Publication date Feb 7, 2008
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER FUSE STRUCTURES FOR HIGH POWER APPLICATIONS
- Publication number 20070120232
- Publication date May 31, 2007
- International Business Machines Corporation
- Stephen E. Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CRACK STOP VOID IN A LOW-K DIELECTRIC LAYER BET...
- Publication number 20060223242
- Publication date Oct 5, 2006
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Unique feature design enabling structural integrity for advanced lo...
- Publication number 20030197280
- Publication date Oct 23, 2003
- International Business Machines Corporation
- Charles R. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIQUE FEATURE DESIGN ENABLING STRUCTURAL INTEGRITY FOR ADVANCED LO...
- Publication number 20030155642
- Publication date Aug 21, 2003
- International Business Machines Corporation
- Charles R. Davis
- H01 - BASIC ELECTRIC ELEMENTS

Dae Young Jung

Person

Patents Grantslast 30 patents

Method and structure to reduce cracking in flip chip underfill

Structure and method for enhancing resistance to fracture of bondin...

Laser fuse structures for high power applications

Semiconductor chip shape alteration

Structure and method for enhancing resistance to fracture of bondin...

Method of inhibition of metal diffusion arising from laser dicing

Method of forming a crack stop void in a low-k dielectric layer bet...

Unique feature design enabling structural integrity for advanced lo...

Unique feature design enabling structural integrity for advanced lo...

Electroless plating with bi-level control of dissolved oxygen, with...

Copper deposition from electroless plating bath

Method for preparing substrates for deposition of metal seed from a...

Electroless plating with bi-level control of dissolved oxygen

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP SHAPE ALTERATION

INHIBITION OF METAL DIFFUSION ARISING FROM LASER DICING

METHOD AND STRUCTURE TO REDUCE CRACKING IN FLIP CHIP UNDERFILL

STRUCTURE AND METHOD FOR ENHANCING RESISTANCE TO FRACTURE OF BONDIN...

SEMICONDUCTOR CHIP SHAPE ALTERATION

STRUCTURE AND METHOD FOR ENHANCING RESISTANCE TO FRACTURE OF BONDIN...

VIA STACK STRUCTURES

LASER FUSE STRUCTURES FOR HIGH POWER APPLICATIONS

METHOD OF FORMING A CRACK STOP VOID IN A LOW-K DIELECTRIC LAYER BET...

Unique feature design enabling structural integrity for advanced lo...

UNIQUE FEATURE DESIGN ENABLING STRUCTURAL INTEGRITY FOR ADVANCED LO...