Daehan YOUN

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Suwon-si, KR

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Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE
- Publication number 20240371718
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Daehan YOUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM ON CHIP HAVING THREE-DIMENSIONAL CHIPLET STRUCTURE AND ELECT...
- Publication number 20230107103
- Publication date Apr 6, 2023
- Samsung Electronics Co., Ltd.
- Daehan YOUN
- H01 - BASIC ELECTRIC ELEMENTS