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Daeho Lee

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  • Hwaseong-si, KR
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240355796
    • Publication date Oct 24, 2024
    • Samsung Electronics Co., Ltd.
    • DAEHO LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED-CHIP PACKAGES
    • Publication number 20240203969
    • Publication date Jun 20, 2024
    • Samsung Electronics Co., Ltd.
    • Daeho LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND STACKED PACKAGE MODULE INCLUDING THE SAME
    • Publication number 20230387090
    • Publication date Nov 30, 2023
    • Samsung Electronics Co., Ltd.
    • Daeho LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220320053
    • Publication date Oct 6, 2022
    • Samsung Electronics Co., Ltd.
    • DAEHO LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION SUBSTRATE
    • Publication number 20220285328
    • Publication date Sep 8, 2022
    • Samsung Electronics Co., Ltd.
    • DONGKYU KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED-CHIP PACKAGES
    • Publication number 20220130811
    • Publication date Apr 28, 2022
    • Samsung Electronics Co., Ltd.
    • Daeho LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND STACKED PACKAGE MODULE INCLUDING THE SAME
    • Publication number 20210407971
    • Publication date Dec 30, 2021
    • Samsung Electronics Co., Ltd.
    • Daeho LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20160056127
    • Publication date Feb 25, 2016
    • Daeho Lee
    • H01 - BASIC ELECTRIC ELEMENTS