DaeHyeok Ha

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Incheon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming protrusion e-bar for 3D SiP
- Patent number 11,342,294
- Issue date May 24, 2022
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming protrusion E-bar for 3D SIP
- Patent number 10,636,756
- Issue date Apr 28, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Conductive Vias to Have...
- Publication number 20230275013
- Publication date Aug 31, 2023
- STATS ChipPAC Pte Ltd.
- SungSoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP
- Publication number 20200219835
- Publication date Jul 9, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP
- Publication number 20200013738
- Publication date Jan 9, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Vias to Have...
- Publication number 20190318984
- Publication date Oct 17, 2019
- STATS ChipPAC Pte Ltd.
- SungSoo Kim
- H01 - BASIC ELECTRIC ELEMENTS