Daesuk Lee

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including via structures with undercut portion...
- Patent number 11,798,866
- Issue date Oct 24, 2023
- Samsung Electronics Co, Ltd.
- Eunji Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including via structure with head and body por...
- Patent number 11,380,606
- Issue date Jul 5, 2022
- Samsung Electronics Co., Ltd.
- Eunji Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including through holes and methods of fabri...
- Patent number 11,373,932
- Issue date Jun 28, 2022
- Samsung Electronics Co., Ltd.
- Hyoukyung Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20220336327
- Publication date Oct 20, 2022
- Samsung Electronics Co., Ltd.
- EUNJI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20210020545
- Publication date Jan 21, 2021
- Samsung Electronics Co., Ltd.
- EUNJI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING THROUGH HOLES AND METHODS OF FABRI...
- Publication number 20210005533
- Publication date Jan 7, 2021
- Samsung Electronics Co., Ltd.
- Hyoukyung Cho
- H01 - BASIC ELECTRIC ELEMENTS