Daesung LEE

Person

Palo Alto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and system for fabricating a MEMS device
- Patent number 12,180,069
- Issue date Dec 31, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Selective self-assembled monolayer patterning with sacrificial laye...
- Patent number 12,139,397
- Issue date Nov 12, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Modification to rough polysilicon using ion implantation and silicide
- Patent number 11,952,267
- Issue date Apr 9, 2024
- Invensense, Inc.
- Alan Cuthbertson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for providing getters in microelectromechanical...
- Patent number 11,945,713
- Issue date Apr 2, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor with dimple features and improved out-of-plane stiction
- Patent number 11,919,769
- Issue date Mar 5, 2024
- Invensense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS tab removal process
- Patent number 11,905,170
- Issue date Feb 20, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator layer patterning with polysilicon and etch stop layer
- Patent number 11,731,871
- Issue date Aug 22, 2023
- Invensense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stiction reduction system and method thereof
- Patent number 11,661,332
- Issue date May 30, 2023
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator layer patterning with topography
- Patent number 11,618,674
- Issue date Apr 4, 2023
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor with dimple features and improved out-of-plane stiction
- Patent number 11,542,154
- Issue date Jan 3, 2023
- Invensense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Modification to rough polysilicon using ion implantation and silicide
- Patent number 11,267,699
- Issue date Mar 8, 2022
- Invensense, Inc.
- Alan Cuthbertson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator layer patterning with topography
- Patent number 10,906,802
- Issue date Feb 2, 2021
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS integrated device without standoff in MEMS
- Patent number 10,773,951
- Issue date Sep 15, 2020
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS MEMS integrated device with increased shield vertical gap
- Patent number 10,773,947
- Issue date Sep 15, 2020
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator layer patterning with topography
- Patent number 10,745,270
- Issue date Aug 18, 2020
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for providing getters in microelectromechanical...
- Patent number 10,384,930
- Issue date Aug 20, 2019
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dual cavity pressure structures
- Patent number 10,308,503
- Issue date Jun 4, 2019
- Invensense, Inc.
- Jong Il Shin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS integrated device including multiple cavities at differen...
- Patent number 10,221,065
- Issue date Mar 5, 2019
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Two different conductive bump stops on CMOS-MEMS bonded structure
- Patent number 10,081,539
- Issue date Sep 25, 2018
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS integrated device with selective bond pad protection
- Patent number 10,035,702
- Issue date Jul 31, 2018
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for mask reduction techniques
- Patent number 9,919,920
- Issue date Mar 20, 2018
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS integrated device including multiple cavities at differen...
- Patent number 9,738,512
- Issue date Aug 22, 2017
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dual cavity pressure structures
- Patent number 9,725,305
- Issue date Aug 8, 2017
- Invensense, Inc.
- Jong Il Shin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS integrated device including a contact layer and methods o...
- Patent number 9,718,680
- Issue date Aug 1, 2017
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS integrated device with selective bond pad protection
- Patent number 9,505,609
- Issue date Nov 29, 2016
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
- Publication number 20250074766
- Publication date Mar 6, 2025
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY
- Publication number 20230202835
- Publication date Jun 29, 2023
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR WITH DIMPLE FEATURES AND IMPROVED OUT-OF-PLANE STICTION
- Publication number 20230100960
- Publication date Mar 30, 2023
- InvenSense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP
- Publication number 20230045563
- Publication date Feb 9, 2023
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
- Publication number 20230037849
- Publication date Feb 9, 2023
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
- Publication number 20230045257
- Publication date Feb 9, 2023
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATOR LAYER PATTERNING WITH POLYSILICON AND ETCH STOP LAYER
- Publication number 20220380209
- Publication date Dec 1, 2022
- InvenSense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL...
- Publication number 20220348455
- Publication date Nov 3, 2022
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR WITH DIMPLE FEATURES AND IMPROVED OUT-OF-PLANE STICTION
- Publication number 20220298009
- Publication date Sep 22, 2022
- InvenSense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS TAB REMOVAL PROCESS
- Publication number 20220185662
- Publication date Jun 16, 2022
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MODIFICATION TO ROUGH POLYSILICON USING ION IMPLANTATION AND SILICIDE
- Publication number 20220144628
- Publication date May 12, 2022
- InvenSense, Inc.
- Alan Cuthbertson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY
- Publication number 20220106188
- Publication date Apr 7, 2022
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SELECTIVE SELF-ASSEMBLED MONOLAYER PATTERNING WITH SACRIFICIAL LAYE...
- Publication number 20210107785
- Publication date Apr 15, 2021
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MODIFICATION TO ROUGH POLYSILICON USING ION IMPLANTATION AND SILICIDE
- Publication number 20200270123
- Publication date Aug 27, 2020
- InvenSense, Inc.
- Alan Cuthbertson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STICTION REDUCTION SYSTEM AND METHOD THEREOF
- Publication number 20200262697
- Publication date Aug 20, 2020
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY
- Publication number 20200131033
- Publication date Apr 30, 2020
- InvenSense, Inc.
- Daesung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY
- Publication number 20200131031
- Publication date Apr 30, 2020
- InvenSense, Inc.
- Daesung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS MEMS INTEGRATED DEVICE WITH INCREASED SHIELD VERTICAL GAP
- Publication number 20190382261
- Publication date Dec 19, 2019
- InvenSense, Inc.
- Daesung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS-MEMS INTEGRATED DEVICE WITHOUT STANDOFF IN MEMS
- Publication number 20190382258
- Publication date Dec 19, 2019
- InvenSense, Inc.
- Daesung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL...
- Publication number 20190330052
- Publication date Oct 31, 2019
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL...
- Publication number 20180312396
- Publication date Nov 1, 2018
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TWO DIFFERENT CONDUCTIVE BUMP STOPS ON CMOS-MEMS BONDED STRUCTURE
- Publication number 20180016135
- Publication date Jan 18, 2018
- InvenSense, Inc.
- Daesung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DUAL CAVITY PRESSURE STRUCTURES
- Publication number 20170297909
- Publication date Oct 19, 2017
- InvenSense, Inc.
- Jong Il Shin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS-MEMS INTEGRATED DEVICE INCLUDING MULTIPLE CAVITIES AT DIFFEREN...
- Publication number 20170183225
- Publication date Jun 29, 2017
- InvenSense, Inc.
- Daesung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS-MEMS INTEGRATED DEVICE WITH SELECTIVE BOND PAD PROTECTION
- Publication number 20170066648
- Publication date Mar 9, 2017
- InvenSense, Inc.
- Daesung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS-MEMS INTEGRATED DEVICE INCLUDING A CONTACT LAYER AND METHODS O...
- Publication number 20160362296
- Publication date Dec 15, 2016
- InvenSense, Inc.
- Daesung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS-MEMS INTEGRATED DEVICE WITH SELECTIVE BOND PAD PROTECTION
- Publication number 20160318755
- Publication date Nov 3, 2016
- InvenSense, Inc.
- Daesung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DUAL CAVITY PRESSURE STRUCTURES
- Publication number 20160272486
- Publication date Sep 22, 2016
- Jong II Shin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS-MEMS INTEGRATED DEVICE INCLUDING MULTIPLE CAVITIES AT DIFFEREN...
- Publication number 20150129991
- Publication date May 14, 2015
- InvenSense, Inc.
- Daesung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Daesung LEE

Person

Patents Grantslast 30 patents

Method and system for fabricating a MEMS device

Selective self-assembled monolayer patterning with sacrificial laye...

Modification to rough polysilicon using ion implantation and silicide

Systems and methods for providing getters in microelectromechanical...

Sensor with dimple features and improved out-of-plane stiction

MEMS tab removal process

Actuator layer patterning with polysilicon and etch stop layer

Stiction reduction system and method thereof

Actuator layer patterning with topography

Sensor with dimple features and improved out-of-plane stiction

Modification to rough polysilicon using ion implantation and silicide

Actuator layer patterning with topography

CMOS-MEMS integrated device without standoff in MEMS

CMOS MEMS integrated device with increased shield vertical gap

Actuator layer patterning with topography

Systems and methods for providing getters in microelectromechanical...

Dual cavity pressure structures

CMOS-MEMS integrated device including multiple cavities at differen...

Two different conductive bump stops on CMOS-MEMS bonded structure

CMOS-MEMS integrated device with selective bond pad protection

Systems and methods for mask reduction techniques

CMOS-MEMS integrated device including multiple cavities at differen...

Dual cavity pressure structures

CMOS-MEMS integrated device including a contact layer and methods o...

CMOS-MEMS integrated device with selective bond pad protection

Patents Applicationslast 30 patents

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE

ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY

SENSOR WITH DIMPLE FEATURES AND IMPROVED OUT-OF-PLANE STICTION

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE

ACTUATOR LAYER PATTERNING WITH POLYSILICON AND ETCH STOP LAYER

SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL...

SENSOR WITH DIMPLE FEATURES AND IMPROVED OUT-OF-PLANE STICTION

MEMS TAB REMOVAL PROCESS

MODIFICATION TO ROUGH POLYSILICON USING ION IMPLANTATION AND SILICIDE

ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY

SELECTIVE SELF-ASSEMBLED MONOLAYER PATTERNING WITH SACRIFICIAL LAYE...

MODIFICATION TO ROUGH POLYSILICON USING ION IMPLANTATION AND SILICIDE

STICTION REDUCTION SYSTEM AND METHOD THEREOF

ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY

ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY

CMOS MEMS INTEGRATED DEVICE WITH INCREASED SHIELD VERTICAL GAP

CMOS-MEMS INTEGRATED DEVICE WITHOUT STANDOFF IN MEMS

SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL...

SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL...

TWO DIFFERENT CONDUCTIVE BUMP STOPS ON CMOS-MEMS BONDED STRUCTURE

DUAL CAVITY PRESSURE STRUCTURES

CMOS-MEMS INTEGRATED DEVICE INCLUDING MULTIPLE CAVITIES AT DIFFEREN...

CMOS-MEMS INTEGRATED DEVICE WITH SELECTIVE BOND PAD PROTECTION

CMOS-MEMS INTEGRATED DEVICE INCLUDING A CONTACT LAYER AND METHODS O...

CMOS-MEMS INTEGRATED DEVICE WITH SELECTIVE BOND PAD PROTECTION

DUAL CAVITY PRESSURE STRUCTURES

CMOS-MEMS INTEGRATED DEVICE INCLUDING MULTIPLE CAVITIES AT DIFFEREN...