DaeSup Kim

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with chip stacking and method o...
- Patent number 9,530,753
- Issue date Dec 27, 2016
- STATS ChipPAC Pte. Ltd.
- DaeSup Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CHIP STACKING AND METHOD O...
- Publication number 20130075915
- Publication date Mar 28, 2013
- DaeSup Kim
- H01 - BASIC ELECTRIC ELEMENTS