DaeWook Yang

Person

Yongin-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with underfill and method of ma...
- Patent number 9,053,953
- Issue date Jun 9, 2015
- Stats Chippac Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of singulating semiconductor wafer...
- Patent number 8,936,969
- Issue date Jan 20, 2015
- STATS ChipPAC, Ltd.
- Hunteak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with mold gate
- Patent number 8,841,782
- Issue date Sep 23, 2014
- Stats Chippac Ltd.
- DaeWook Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming pre-molded substrate to...
- Patent number 8,836,097
- Issue date Sep 16, 2014
- STATS ChipPAC, Ltd.
- DaeWook Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with ultra-thin chip and method...
- Patent number 8,716,108
- Issue date May 6, 2014
- Stats Chippac Ltd.
- Hun Teak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with an encapsulation and metho...
- Patent number 8,709,877
- Issue date Apr 29, 2014
- Stats Chippac Ltd.
- DaeWook Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with underfill and methods of m...
- Patent number 8,421,201
- Issue date Apr 16, 2013
- Stats Chippac Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming pre-molded substrate to...
- Patent number 8,409,918
- Issue date Apr 2, 2013
- STATS ChipPAC, Ltd.
- DaeWook Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN ENCAPSULATION AND METHO...
- Publication number 20130334668
- Publication date Dec 19, 2013
- DaeWook Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Singulating Semiconductor Wafer...
- Publication number 20130249079
- Publication date Sep 26, 2013
- STATS ChipPAC, Ltd.
- Hunteak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ULTRA-THIN CHIP AND METHOD...
- Publication number 20130249117
- Publication date Sep 26, 2013
- Hun Teak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Pre-Molded Substrate to...
- Publication number 20130200527
- Publication date Aug 8, 2013
- STATS ChipPAC, Ltd.
- DaeWook Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Pre-Molded Substrate to...
- Publication number 20120056334
- Publication date Mar 8, 2012
- STATS ChipPAC, Ltd.
- DaeWook Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDERFILL AND METHOD OF MA...
- Publication number 20100320587
- Publication date Dec 23, 2010
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOLD GATE
- Publication number 20100038804
- Publication date Feb 18, 2010
- DaeWook Yang
- H01 - BASIC ELECTRIC ELEMENTS

DaeWook Yang

Person

Patents Grantslast 30 patents

Integrated circuit packaging system with underfill and method of ma...

Semiconductor device and method of singulating semiconductor wafer...

Integrated circuit package system with mold gate

Semiconductor device and method of forming pre-molded substrate to...

Integrated circuit packaging system with ultra-thin chip and method...

Integrated circuit packaging system with an encapsulation and metho...

Integrated circuit packaging system with underfill and methods of m...

Semiconductor device and method of forming pre-molded substrate to...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN ENCAPSULATION AND METHO...

Semiconductor Device and Method of Singulating Semiconductor Wafer...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ULTRA-THIN CHIP AND METHOD...

Semiconductor Device and Method of Forming Pre-Molded Substrate to...

Semiconductor Device and Method of Forming Pre-Molded Substrate to...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDERFILL AND METHOD OF MA...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOLD GATE