Daewoong Heo

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for bonding wire
- Patent number 12,154,883
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Daewoong Heo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANUFACTURED USING...
- Publication number 20240363581
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Daewoong HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ALIGNMENT PATTERN
- Publication number 20240213175
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Daewoong HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240087983
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Daewoong HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BONDING WIRE
- Publication number 20240038717
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Daewoong Heo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR SUBSTRATE PROCESSING APPARATUS
- Publication number 20230395358
- Publication date Dec 7, 2023
- Samsung Electronics Co., Ltd.
- Daewoong Heo
- B08 - CLEANING